TSMC Bumping Service Benefits:
TSMC's chip-package-integration qualification in advanced Si nodes saves up to 9 months on customer products' flip chip package development.
TSMC has built a reputation to manage bump and wafer sort production through TSMC in-house manufacturing or outsourcing toed assembly and test suppliers. TSMC's integrated operation streamlines planning and simplifies supply chain management.
TSMC offers leading edge wafer bumping services:
|Bump Material||Lead Free||Cu|
|Bump Material (Plated)||SnAg||Cu / SnAg Cap|
|Available Wafer Sizes||12"||12"|
|Max. Chip Size (mm2)||<400||<700|
|Min. Bump Pitch (um)||150||80|
|Ultra Low Alpha Particle Emission||Yes||Yes|