0.13-micron Technology

TSMC launched the semiconductor industry's first 0.13-micron (µm) low-k, copper system-on-a-chip (SoC) process technology. The Company insisted on building its own R&D capabilities and made a key decision early on that contributed to this success when it declined a joint development invitation from a well-known IDM (Integrated Device Manufacturer). TSMC based its R&D team at the Company's Hsinchu headquarters and successfully developed the technology ahead of IDMs and other foundries. This accomplishment not only marked Taiwan's capability to develop advanced technology but also became a cornerstone for growing Taiwan's semiconductor industry.

TSMC's 0.13µm SoC low-k copper technology integrates multiple world-class SoC CMOS transistor process platforms, ultra-small SRAM memory (2.43-1.87 square µm), the world's latest 193nm lithography, and the world's first eight-layer low-k (k≤2.9) copper wire . Today, it sees broad application in consumer electronics, computers, mobile computing, automotive electronics, IoT, and smart wearables.

0.13-micron Technology

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