3-micron Technology

TSMC has persistently maintained a “building in-house R&D” strategy since its founding in 1987, which has given the company significant competitive advantages.

While TSMC started the Company by transferring 2-micron (µm) and 3.5µm technologies from Industrial Technology Research Institute of Taiwan, it customized a 3.0µm technology for Philips (the Netherlands). After only one year, TSMC successfully developed its own 1.5µm technology in 1988. A series of continuing successful developments followed, including 1.2µm, 1.0µm, 0.8µm, 0.6µm, 0.5µm, 0.3µm, and 0.25µm processes.

In 1999, TSMC released the world's first 0.18µm Low Power process technology. Since then, TSMC has set scores of records, leading the industry with ever-shrinking line width technology from 0.13µm, through 90nm, 65nm, 40nm, 28nm, 20nm, 16/12nm, to today's most advanced 10nm and 7nm processes.

Because of its “building in-house R&D” strategy and its continuous investment in R&D, TSMC is a semiconductor technology leader, helping companies around the globe unleash their IC innovations.

3-micron Technology

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