Wafer Level System Integration (WLSI)

With the proliferation of AI and 5G from cloud data center to network router to edge applications, according to IDC 2017, the global data traffic will grow from 16 ZB in 2016 to 163 ZB in 2026, a 10X growth in 10 years. Data processing with fast speed and low power consumption becomes common pursuits in all applications. The innovations in system integration has become a key dimension and is accelerating to keep pace with the insatiable demands for data bandwidth, computing speed, and computing efficiency.

TSMC Wafer Level System Integration (WLSI) is leading the semiconductor industry into a new era of system scaling that goes beyond the scope defined by Moore's Law. Innovative 3DIC technology platforms, such as CoWoS® (Chip on Wafer on Substrate), InFO (Integrated Fan Out), and SoIC (System on Integrated Chips) enable innovation through chiplet partitioning and systems integration that achieves greater functionality and enhanced system performance at increasingly competitive costs.

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Thank you for visiting TSMC's Wafer Level System Integration Technology Platform. I am Doug Yu, honored to be your host here.

We all know chip-scaling is becoming more challenging every generation nowadays. It is very desirable to maintain Moore's Law, or transistor scaling. In the meantime, heterogeneous integration of chips are needed to enable many, so called, More-Than-Moore applications. These challenges are becoming more and more severe, but they also represent exciting opportunities today.

TSMC has been putting a lot of efforts in tackling these challenges. I am very happy to introduce to you our innovative WLSI Technology Platform. This is the industry's first system integration technology platform.

Why do we do wafer-form system integration, instead of panel-form in conventional packaging? There are several important considerations.

First, wafer-form system integration allows seamless integration of front end wafer process and back end chip packaging, which provides great values and will be explained in details later. TSMC has the most advantages to enable the first system-integration-technology foundry service in industry to foster system innovations in 5G, AI, IoT, and autonomous drive era.

Secondly, wafer-form system integration leverages our wafer process expertise in Cu interconnect technology, installed capacity, yield learning, and quality assurance, etc. This unique value ultimately differentiates system performance, power, form-factor and time-to-volume for more advanced applications.

Thirdly, it leverages our comprehensive IC design ecosystem, and grow from IC design support to system design support for time-to-design.

Our innovative Wafer Level System Integration Technology Platform consists of CoWoS, InFO, and SoIC today. The broad portfolio is still growing both vertically and horizontally to meet the diverse application requirements not only for aforementioned near-term but also for long-term market needs.

Once again, welcome and please visit our website to see the details of each exciting technology we offer from the WLSI technology platform.

Intro to Wafer Level System Integration Technologies

Dr. Doug Yu introduces TSMC's industry-leading wafer level system integration technologies and explains how the innovative wafer-form approach paves the way for the new era of heterogeneous integration.
WLSI Platform's Complete System Integration Portfolio
CoWoS

Best in breed performance for high performance computing applications

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InFO

Best cost/performance for high density, high performance mobile, network applications

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SoIC

Chiplets stacking with exceptional performance, form factor, and power saving

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