TSMC provides foundry's most comprehensive and competitive Bipolar-CMOS-DMOS (BCD) Power Management process technologies and is also the first foundry to adopt 300mm wafer production for the BCD Power Management process.
TSMC BCD Power Management process features higher integration, smaller footprint, lower power consumption, covering nodes from 0.6µm to 40nm. Customers chips produced by the process provide more stable and efficient power supplies that consume less energy, ideal for applications including consumer electronics, communication devices, and computers.
TSMC's 12-inch 0.13μm BCD Plus technology, which provides superior cost competitiveness compared to the prior 0.13μm BCD technology, passed process validation by customers and started production in the second half of 2017.
0.18μm BCD third generation, which started volume production in the second half of 2017, passed AEC-Q100 Grade-1 qualification in 2018. This technology provides superior cost competitiveness compared to the second generation BCD.
TSMC's 8-inch 90nm BCD technology is expected to pass the qualification and is now receiving tape-outs from customers. This technology provides superior cost competitiveness compared to the 0.18μm BCD platform, especially in power management IC Platform for 5G smartphones.
TSMC's 12-inch 40nm BCD technology, which integrates RRAM model, is expected to pass the qualification in August 2019. This technology provides power efficiency for high-speed communication interface on smartphones, IoT, and so on.