TSMC has always insisted on building a strong, in-house R&D capability. As a global semiconductor technology leader, TSMC provides the most advanced and comprehensive portfolio of dedicated foundry process technologies.
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3nm Technology
In 2022, TSMC led the foundry to start 3nm FinFET (N3) technology high volume production. TSMC’s 3nm process is the industry’s most advanced semiconductor technology...
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5nm Technology
TSMC's 5nm Fin Field-Effect Transistor (FinFET) process technology is optimized for both mobile and high performance...
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7nm Technology
TSMC's 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry's most competitive logic density...
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10nm Technology
TSMC's 10nm Fin Field-Effect Transistor (FinFET) process provides the most competitive combination of performance, power, area...
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16/12nm Technology
In November 2013, TSMC became the first foundry to begin 16nm Fin Field Effect Transistor (FinFET) risk production...
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20nm Technology
TSMC became the world's first semiconductor company that begins 20nm volume production, using its innovative double patterning...
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22nm Technology
22nm ultra-low power (22ULP) technology was developed based on TSMC's industry-leading 28nm technology and completed all process...
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28nm Technology
TSMC became the first foundry to provide the world's first 28nm General Purpose process technology in 2011 and has been adding...
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40nm Technology
TSMC became the first foundry to mass produce a variety of products for multiple customers using its 40nm process...
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65nm Technology
TSMC became the first foundry to begin 65nm risk production in 2005 and passed product certification the following year...
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90nm Technology
TSMC became the first semiconductor company to produce fully-functional 90nm chips using immersion lithography...
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0.13-micron Technology
TSMC launched the semiconductor industry's first 0.13-micron (µm) low-k, copper system-on-a-chip (SoC) process technology...
TSMC launched the semiconductor industry's first 0.13-micron (µm) low-k, copper system-on-a-chip (SoC) process technology. The Company insisted on building its own R&D capabilities and made a key decision early on that contributed to this success when it declined a joint development invitation from a well-known IDM (Integrated Device Manufacturer). TSMC based its R&D team at the Company's Hsinchu headquarters and successfully developed the technology ahead of IDMs and other foundries. This accomplishment not only marked Taiwan's capability to develop advanced technology but also became a cornerstone for growing Taiwan's semiconductor industry.
TSMC's 0.13µm SoC low-k copper technology integrates multiple world-class SoC CMOS transistor process platforms, ultra-small SRAM memory (2.43-1.87 square µm), the world's latest 193nm lithography, and the world's first eight-layer low-k (k≤2.9) copper wire . Today, it sees broad application in consumer electronics, computers, mobile computing, automotive electronics, IoT, and smart wearables.
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0.18-micron Technology
TSMC offered the world's first 0.18-micron (µm) low power process technology in 1998. The Company continued to build...
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3-micron Technology
TSMC has persistently maintained a “building in-house R&D” strategy since its founding in 1987, which has given the company...
