High-Performance Computing Platform

Emerging AI and 5G applications such as connected devices, smart cars, virtual reality/augmented reality, and intelligent manufacturing are driving explosive data growth. The result is unprecedented demand for compute power in cloud datacenters and communication infrastructures.

Wired and wireless infrastructure devices are accelerating their migration towards leading-edge technologies in order to achieve higher performance, better power efficiency, and improved functionality – leading to better system level differentiation. In addition, high-speed interfaces are supporting faster data throughput and improved connectivity.

Given the insatiable compute demand, we see customers not only using our leading edge process technologies, but also increasingly adopting our comprehensive Wafer Level System Integration technologies, as a new axis/dimension beyond traditional Moore’s-Law scaling.

A broad IP ecosystem, nurtured through years of investment by us and by our partners, helps our customers with first-time-right design and fast time-to-market.

TSMC's High-Performance Computing Platform includes:

  • Leading-edge process technologies
  • Connectivity Solutions
  • Wafer Level System Integration (WLSI) including 3DIC
  • Comprehensive IP ecosystem
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TSMC's High-Performance Computing platform helps create AI and 5G innovation that spurs market growth.

TSMC's High-Performance Computing platform helps create AI and 5G innovation that spurs market growth.

Featured Technologies
Advanced Technologies

Industry's most advanced and comprehensive technologies for High-Performance...

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Connectivity

RF technologies and customizations for highly differentiated products...

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WLSI

Wafer Level System Integration (WLSI) provides both...

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