World-class density and performance with TSMC CIS

TSMC's CIS technology has gone through the evolution from FSI to BSI to NIR. Our CIS technology enable higher resolution, HDR and Global shutter, making it a powerful module for machine vision application in IoT.

pixel-level-stacked CIS technology

NIR+ offers more than 3X boost to Quantum Efficiency reaching or exceeding 40% at NIR wavelength, attracting increased customer adoptions in fields of applications such as security camera, 3D-sensing camera etc.

NIR+ offers more than 3X boost to Quantum Efficiency reaching or exceeding 40% at NIR wavelength

The emerging applications, such as 2D/3D face recognition, smart security, smart locks, smart warehouse, face pay, cashier-free services etc., accentuate the need for IoT sensors with integrated AI and connectivity capabilities. CIS technology is the best way to integrate these technologies in one chip.

Featured Technologies
ULL/ULP

Comprehensive ultra-low power technology platform...

LEARN MORE
NVM

Logic compatible and low cost NVM solutions...

LEARN MORE
CIS

World-class density and performance...

LEARN MORE
MEMS

Capacitive and Piezoelectric u-Phone solutions...

LEARN MORE
RF

5G connectivity...


LEARN MORE

Related Information