Industry 1^st high density 2D/3D Fan Out Wafer-Level-Packaging, InFO_PoP leverages high density RDL and fine pitch TIV technologies to integrate mobile AP into a compact 3D system for cost and performances. It features thinner profile, cooler thermal, and improved PI/SI for smartphone application since no organic substrate and C4 bumps. InFO_PoP continues to grow packaging density and performances to fulfill customer needs on 5G/AI applications.

For 5G wireless communication, InFO_AiP (InFO with antenna in Package) Integrates dipole and patch antenna with mmWave FEM chip leveraging high density RDL and fine pitch TIV. Proprietary low-Dk dielectric material and uniform RDL enable high gain and low loss. Qualified 12mm x 12mm x 0.9mm package with 2 RDLs.