OpenFive transforms ideas into highly optimized domain-specific custom SoCs. OpenFive enhances the value of our customers' products by innovating at every stage of design – architecture, logic, physical, system, software, IP – and then continues to partner to deliver fully tested silicon and platforms. OpenFive has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 350+ tape-outs and shipped over 150 million ASICs to date.
OpenFive is also a long-standing partner of TSMC through the Open Innovation Platform® (OIP)Value Chain Aggregator (VCA) program, OpenFive drives leading-edge SoC solutions in HPC/AI, networking, and storage applications that enable chip and system companies to accelerate their designs on TSMC’s leading-edge technology nodes down to 5nm.
Visit openfive.com to learn more about OpenFive’s custom Idea-to-Silicon solutions:
- Leading-edge 5nm, 6nm, 7nm, and 12/16nm FinFET process nodes and more mature process
- 2.5D advanced packaging with CoWoS® and chiplets with silicon interposer and organic substrates
- Advanced methodologies for high-performance and power-optimized AI-enabled SoC designs
- Differentiated and customizable IP portfolio including:
- High-Bandwidth Memory (HBM3/2E/2)
- Die-to-Die (D2D) interface IP for multi-die connectivity including chiplets
- Low-latency, high-throughput Interlaken interface IP for chip-to-chip connectivity
- 400/800G Ethernet MAC/PCS subsystems
- USB controller IP
- Easy access to Ecosystem IP including 112G SerDes, PCIe Gen5, CXL, TCAMs, High-Speed ADC/DACs
- Flexible engagement models: Specification, netlist, and GDS2 handoffs
OpenFive provides the most flexible engagement model in the ASIC industry. We can engage at Spec Handoff, RTL Handoff, Netlist Handoff, GDSII Handoff or Production Handoff. We then seamlessly handle every aspect of the entire process, from design engineering, IP procurement, fabrication, package assembly & test, silicon validation, and production through end-of-life.
OpenFive has a dedicated IP team that works with a wide variety of IP providers and is continually qualifying and ranking IP and updating our portfolio of recommended IP. We make informed IP decisions that assure IP quality, reusability, and deliver first-time working silicon.
Our capability to tailor IP to your specific needs combined with our wide portfolio of IP enables us to provide the optimal IP solution for each SoC.
The OpenFive Manufacturing Operations team brings years of semiconductor manufacturing experience and operations engineering expertise to every engagement. A team of fab, packaging, test and product engineers work closely with our customer to identify and select the right process technology solution for each design. Selecting the process node and the optimal process options requires careful comparison of design objectives, market applications and target price. OpenFive has designed and manufactured custom ASICs in nearly all available TSMC process nodes. Such experience has involved a tight collaboration between OpenFive and TSMC since the inception of Open-Silicon (2003).
Each stage of Manufacturing is monitored and tracked on an Online WIP portal accessible to our customers. After RTP (Release to Production) our global manufacturing team ensures that the products meet and exceed the yield and quality targets which is evident by the very low DPPM achieved since Open-Silicon's inception in 2003 (average 25 DPPM return rate for over 150 million units shipped).
If you would like our sales team to contact you, you require more information about our products and services, or you wish to share your feedback, please contact us below.
https://openfive.com/contact-us/
info@openfive.com
OpenFive has a global engineering and sales presence with offices in North America, China, Europe, and India.
- Corporate Headquarters 490 N. McCarthy Blvd.
Suite 220
Milpitas, CA 95035
TEL: 408.240.5700
info@openfive.com - For China enquiries: info.cn@openfive.com
