Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design – architecture, logic, physical, system, software, IP – and then continues to partner to deliver fully tested silicon and platforms. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ tapeouts and shipped over 125 million ASICs to date.
Flexible Design Engagement Model:
Open-Silicon provides the most flexible engagement model in the ASIC industry. We can engage at Spec Handoff, RTL Handoff, Netlist Handoff, GDSII Handoff or Production Handoff. We then seamlessly handle every aspect of the entire process, from design engineering, IP procurement, fabrication, package assembly & test, silicon validation, and production through end-of-life.
Open-Silicon has a dedicated IP team that works with a wide variety of IP providers and is continually qualifying and ranking IP and updating our portfolio of recommended IP. Our primary goal is to make informed IP decisions that assure IP quality, reusability, and deliver first-time working silicon. Our IP experts work continuously with customers and IP vendors to identify market needs. Our capability to tailor IP to your specific needs combined with our wide portfolio of IP enables us to provide the optimal IP solution for each SoC.
Operations Engineering Services:
Open-Silicon Manufacturing Operations team brings years of semiconductor manufacturing experience and Operations engineering expertise to every engagement. A team of fab, packaging, test and product engineers work closely with our customer to identify and select the right process technology solution for each design. Selecting the process node and the optimal process options requires careful comparison of design objectives, market applications and target price. Open-Silicon has designed and manufactured custom ASICs in nearly all available TSMC process nodes. Such experience requires a tight collaboration between Open-Silicon and TSMC since the inception of Open-Silicon (2003).
Each stage of Manufacturing is monitored and tracked on an Online WIP portal accessible to our customers. After RTP (Release to Production) our global manufacturing team ensures that the products meet and exceed the yield and quality targets which is evident by the very low DPPM achieved since Open-Silicon's inception in 2003 (average 30 DPPM return rate for over 125 million units shipped).