晶圆级系统整合

With the proliferation of AI and 5G from cloud data center to network router to edge applications, according to IDC 2017, the global data traffic will grow from 16 ZB in 2016 to 163 ZB in 2026, a 10X growth in 10 years. Data processing with fast speed and low power consumption becomes common pursuits in all applications. The innovations in system integration has become a key dimension and is accelerating to keep pace with the insatiable demands for data bandwidth, computing speed, and computing efficiency.

TSMC Wafer Level System Integration (WLSI) is leading the semiconductor industry into a new era of system scaling that goes beyond the scope defined by Moore's Law. Innovative 3DIC technology platforms, such as CoWoS® (Chip on Wafer on Substrate), InFO (Integrated Fan Out), and SoIC (System on Integrated Chips) enable innovation through chiplet partitioning and systems integration that achieves greater functionality and enhanced system performance at increasingly competitive costs.

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感谢您造访台积电晶圆级系统整合技术平台,我是Doug Yu(余振华),很荣幸能担任今日的主持人。

大家都知道现在每一代晶片微缩的挑战性越来越高,维持摩尔定律或电晶体微缩相当令人期盼、向往。于此同时,也需要晶片的异质整合实现所谓的超越摩尔应用。这些挑战变得越来越严峻,却也提供令人振奋的创新机会。

台积电一直致力于克服这些挑战,本人很高兴向各位介绍台积电创新的WLSI技术平台,此为业界首创晶圆级系统整合技术平台。

为什么台积电选择晶圆级系统整合,而非传统封装中的面板级系统整合?这部分有若干重要考量。

首先,晶圆级系统整合可实现前端晶圆制程及后端晶片封装的无缝整合,提供相当大的价值,这部分稍后将做更详细的说明。台积电掌握先进晶圆制造及先进晶圆级系统整合全方位的优势,得以实现业界首创系统整合技术代工服务,促进5G、AI、物联网及自驾时代的系统创新。

其次,晶圆级系统整合充分善用台积电在铜导线技术、量产产能、良率学习与品质保证等晶圆制程专长技术。这项独特的价值让更先进系统应用在系统效能、功耗、微型化与及时上市量产形成彻底差异化优势。

第三,它充分利用台积电全方位的IC设计生态系统,从IC设计支援发展至系统设计支援的及时协同设计。

目前台积电的创新晶圆级系统整合技术平台结合CoWoS、InFO和SoIC三技术平台。各式产品组合持续在水平尺寸增长及垂直晶片堆叠发展,除满足前述现有市场需求,亦可符合长期市场的各种应用需求。

再一次欢迎您造访台积电网站,浏览我们在WLSI技术平台所提供的各项先进技术的资讯。

Intro to Wafer Level System Integration Technologies

Dr. Doug Yu introduces TSMC's industry-leading wafer level system integration technologies and explains how the innovative wafer-form approach paves the way for the new era of heterogeneous integration.
WLSI Platform's Complete System Integration Portfolio
CoWoS

Best in breed performance for high performance computing applications

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InFO

Best cost/performance for high density, high performance mobile, network applications

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SoIC

Chiplets stacking with exceptional performance, form factor, and power saving

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