October 26 | North America
October 27 | China and Europe
The TSMC OIP Ecosystem Forum brings together TSMC's design ecosystem partners and customers to share practical, tested solutions to today's design challenges.
More than 95% of last year's event attendees found that the Forum helped them better understand TSMC's Open Innovation Platform and found it insightful to hear directly from TSMC OIP member companies. This year's event will prove equally valuable, providing an opportunity for you to learn how TSMC OIP partners apply their technologies and design solutions to address your high-performance computing (HPC), mobile, automotive, and Internet-of-Thing (IoT) design challenges.
This year’s online forum kicks off with trend-setting talks and announcements from TSMC and leading IC design company executives. The technical sessions are dedicated to 35 selected papers from TSMC's EDA, IP, Design Center Alliance, and Value Chain Aggregator partners. Also, the Ecosystem Pavilion features 70 OIP member companies showcasing their products and services.