10/26 | North America — Online for 6 Months
11/08 | Europe — Online for 6 Months
12/13 | China — Online
The TSMC 2022 Open Innovation Platform® (OIP) Ecosystem Forum is BACK and in-person this year in North America, Europe, and China.
OIP Ecosystem Forum is a one-of-a-kind technical conference that brings together the semiconductor design community. It features the latest TSMC design enablement updates, insights from industry luminaires, and multi-track technical sessions covering hot topics for Mobile, Automotive, High-Performance Computing, 3DIC, IoT and RF applications.
And you can’t miss the OIP Ecosystem Partner Pavilion where ecosystem partners display their latest technology enhancing innovations.
Join the semiconductor design community to discover and discusses the latest technologies and design solutions. Don’t miss learning how TSMC technologies, the OIP ecosystem and the ecosystem partners unleash the future of innovation.