We’re excited to announce the 2023 Open Innovation Platform® (OIP) Ecosystem Forum is going global! And we’re thrilled to host both in-person and online events in six locations: North America, Europe, and China; with first-time events in Japan, Taiwan, and Israel.
TSMC’s OIP Ecosystem Forum is a one-of-a-kind technical conference that brings together the semiconductor design community. It features the latest TSMC design enablement updates, insights from industry luminaires, and multi-track technical sessions covering hot topics in Mobile, Automotive, High-Performance Computing, 3DIC, IoT and RF applications.
And you can’t miss the OIP Ecosystem Partner Pavilion where ecosystem partners display their latest technology enhancing innovation.
Join the semiconductor design community to discover and discusses the latest technologies and design solutions. Don’t miss learning how TSMC technologies, the OIP ecosystem, and the ecosystem partners unleash the future of innovation.