TSMC 2023
Global OIP Ecosystem Forum

6
Regional Events
150+
Exhibitions
220+
Technical Talks
5000+
Attendees
OIP 2023
Please join us for the

TSMC 2023
OIP ECOSYSTEM FORUM

We’re excited to announce the 2023 Open Innovation Platform® (OIP) Ecosystem Forum is going global! And we’re thrilled to host both in-person and online events in six locations: North America, Europe, and China; with first-time events in Japan, Taiwan, and Israel.

TSMC’s OIP Ecosystem Forum is a one-of-a-kind technical conference that brings together the semiconductor design community. It features the latest TSMC design enablement updates, insights from industry luminaires, and multi-track technical sessions covering hot topics in Mobile, Automotive, High-Performance Computing, 3DIC, IoT and RF applications.

And you can’t miss the OIP Ecosystem Partner Pavilion where ecosystem partners display their latest technology enhancing innovation.

Join the semiconductor design community to discover and discusses the latest technologies and design solutions. Don’t miss learning how TSMC technologies, the OIP ecosystem, and the ecosystem partners unleash the future of innovation.

At this year's OIP, learn about:

  • Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22
  • Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes including InFO, CoWoS®, and TSMC-SoIC technologies, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications
  • Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting 5G, automotive, and IoT applications
  • Ecosystem specific TSMC reference flow implementations, P&R optimization, and machine learning to improve design quality and productivity and cloud-based design solutions
  • Successful, real-life applications of design technologies and IP solutions from TSMC’s Open Innovation Platform® (OIP) ecosystem members and TSMC customers to speed up time-to-design and time-to-market.
OIP 2023

TSMC 2023 OIP Video on Demand Registration

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TSMC 2023
Open Innovation Platform
Ecosystem Forum
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