Join us for the
2024 TSMC OIP
ECOSYSTEM FORUM
Get ready for a transformative event that will spark innovations of today and tomorrow's semiconductor designs at the 2024 TSMC Global Open Innovation Platform (OIP) Ecosystem Forum!
This year’s forum is set to ignite excitement with a focus on how AI is transforming chip design and the latest advances in 3DIC system design. Join industry trailblazers and TSMC’s ecosystem partners for an inside look at the latest innovations and breakthroughs.
Through a series of compelling, multi-track presentations, you’ll witness firsthand how the ecosystem is collaborating to address critical design challenges and leverage AI in chip design processes.
Engage with thought leaders and innovators at this unique event, available both in-person and online across major global locations, including North America, Japan, Taiwan, China, Europe, and Israel.
Don’t miss out on this opportunity to connect with the forefront of semiconductor technology.
REGISTER NOWOpportunity to gain
insight into
- Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2, and N3 processes.
- Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications.
- Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting 5G, automotive, and IoT designs.
- Ecosystem-specific AI-assisted design flow implementations for 2D and 3DIC design productivity and optimization.
- Successful, real-life applications of design technologies, IP solutions, and cloud-based designs from TSMC's Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market.
