Hsinchu, Taiwan, R.O.C., November 8, 2016 – TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:
1. Approved capital appropriations of approximately US$4,908.9 million for purposes including: 1) Installation and expansion of advanced technology capacity; 2) Upgrading advanced packaging capacity to next generation technology; 3) First quarter 2017 R&D capital investments and sustaining capital expenditures.
2. Approved the following personnel promotions:
•Promoted Vice President of Operations Organization Mr. YP Chin to Senior Vice President
•Promoted Vice President of R&D Organization Dr. YJ Mii to Senior Vice President
•Promoted Senior Director of R&D Organization’s Integrated Interconnect & Packaging Dr. CH Yu to Vice President
•Promoted Senior Director of R&D Organization’s More-than-Moore Technologies and TSMC Fellow Dr. Alexander Kalnitsky to Vice President
3. Approved the appointment of Dr. Kevin Zhang as Vice President of Design and Technology Platform (DTP). Dr. Kevin Zhang will be responsible for Memory and Mixed Signal & RF Solutions and reports to Dr. Cliff Hou, Vice President of DTP, directly.
Profile of Dr. Kevin Zhang: Dr. Zhang received his B.S. from Tsinghua University in Beijing in 1987 and his Ph.D. from Duke University in 1994, both in Electrical Engineering. After his graduation, Dr. Zhang served in Motorola and HP, and then spent close to 20 years in Intel Corporation, with various positions in IP development, design solution validation and management.