TSMC Board of Directors Resolutions

Hsinchu, Taiwan, R.O.C. – May 10, 2011 –TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which approved capital appropriations of approximately US$1,599.2 million to expand advanced technology process capacity and upgrade certain 12-inch wafer capacity to specialty technologies.

TSMC Spokesperson

Wendell Huang
Vice President & Chief Financial Officer & Spokesperson
Tel: 886-3-5055901

Acting Spokesperson/Media Contacts

Elizabeth Sun
Senior Director, TSMC Corporate Communications Division
Tel: 886-3-5682085