Hsinchu, Taiwan, R.O.C. – May 14, 2013 –TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:
1. Approved capital appropriations totaling approximately US4,901.9 million for the purpose of R&D and capacity expansion for advanced process technologies, construction of 12-inch GigaFabTM facilities, and installation of facility systems.
2. Approved the issuance of unsecured straight corporate bonds in the domestic market for an amount not exceeding NT$45 billion to raise capital for capacity expansion.