TSMC Board of Directors Meeting Resolutions

Hsinchu, Taiwan, R.O.C. – May 14, 2013 –TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:

1. Approved capital appropriations totaling approximately US4,901.9 million for the purpose of R&D and capacity expansion for advanced process technologies, construction of 12-inch GigaFabTM facilities, and installation of facility systems.

2. Approved the issuance of unsecured straight corporate bonds in the domestic market for an amount not exceeding NT$45 billion to raise capital for capacity expansion.

TSMC Spokesperson

Wendell Huang
Vice President & Chief Financial Officer & Spokesperson
Tel: 886-3-5055901

Acting Spokesperson/Media Contacts

Elizabeth Sun
Senior Director, TSMC Corporate Communications Division
Tel: 886-3-5682085