HSIN CHU, Taiwan, January 17, 1997 -- Taiwan Semiconductor Manufacturing Company (TSMC) announced today that Dr. John Y. Chen, R&D vice-president of TSMC, will be appointed vice-president of operations of WaferTech LLC, TSMC's joint venture company in Camas, Washington. Dr. Stephen T. Tso will take over Dr. Chen's position as R&D vice-president at TSMC.
"Since we broke ground last July, construction of WaferTech has progressed smoothly. We expect to have completed construction, begin transfer of process technology this year, and launch production in 1998.", said Mr. Donald Brooks, TSMC President, "The appointment of Dr. John Y. Chen to WaferTech is of strategic importance. Dr. Chen has been with TSMC since 1992, where he moved from being responsible for backend operation and product engineering, to technology development. In his new assignment, he will be responsible for fab construction, technology transfer from TSMC to WaferTech and wafer production."
Mr. Brooks went on, "Thanks to all R&D staff and managers, TSMC's process technology has now reached world standard. In the future, the ability to sustain technology leadership will be a critical factor for the success of the company. We welcome Dr. Tso on board, and look forward to a bright future under his leadership in developing 0.25um and 0.18um technologies to meet customer needs."
Dr. Tso has been working in the semiconductor industry for seventeen years. His related achievements include the development of IC products and process technology, the improvement of product reliability and yield, and the development of process equipment. Dr. Tso comes to TSMC from Applied Materials, where he first served as general manager of Metal CVD Division for one year, and later became general manager of CVDII-Advanced Technology. Prior to working for Applied Materials, Dr. Tso was Director of Wafer Fab Operations at SGS-Thomson Microelectronics from 1989 to 1992, and in 1992 was promoted to vice-president of the wafer fab. At SGS- Thomson, he was responsible for the development and fabrication of 486 CPU and chip sets utilizing 0.7um technology. Dr. Tso started his career in 1979 at Texas Instruments where he began as a member of the technical staff, and moved to the position of engineering manager.
After graduating from the Physics Department at National Taiwan University, Dr. Tso pursued further education in the US, and received his master and Ph.D. degrees in Materials Science and Engineering at UC Berkerley in 1976 and 1979, respectively.
TSMC is the world's largest and fastest growing dedicated semiconductor foundry manufacturing 1.5 million six-inch wafers per year in 1996. TSMC's net sales for 1996 were US$1.4 billion, posting growth of 37%. The company offers CMOS fabrication processes that focus on advanced logic, mixed signal and a wide array of memory processes. TSMC is located in Hsin Chu, Taiwan. The company has subsidiaries in the United States and Europe. In November 1995, TSMC announced plans to build WaferTech, a $1.2 billion joint venture with Altera, ADI and ISSI. WaferTech is dedicated to providing wafer manufacturing service and is the first one of this kind in the US. The company is located in Camas, Washington, and broke ground for its first fab in July, 1996. The fab will have a monthly output of 30,000 8-inch wafers.