Hsinchu, Taiwan, R.O.C., November 10, 2009 –TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:
1. Approved capital appropriations of US$2,240.8 million to expand advanced technology capacity for twelve-inch wafer fabs, and increase twelve-inch capacity for wafer level chip scale packaging process.
2. Approved capital appropriations of US$254.6 million to expand 12-inch wafer fab facilities.
3. Approved capital appropriations of US$46 million to set up a production line and product development lab for solid state lighting.
4. Appointed Dr. Jack Sun as Chief Technology Officer of TSMC, in charge of formulating TSMC’s technology strategy and conducting the development of the company’s most advanced technologies. Dr. Sun will report directly to Dr. S.Y. Chiang, Senior Vice President of Research and Development.