Ralink Technology Announces Low-Power Single-Chip Radio Transceiver for 2.4 GHz Wireless Local Area Networks (WLAN)

Cupertino, Calif. —September 14, 2002 — Ralink Technology, Corp., a developer of Wireless Local Area Network (WLAN) semiconductor chipsets, today announced a single-chip 2.4 GHz radio transceiver using Taiwan Semiconductor Manufacturing Company’s (TSMC) 0.35-micron, 3.3 volt SiGe BiCMOS process.

The RT2420, Ralink’s 2.4 GHz radio transceiver, is the first IC of the company’s advanced 802.11b WLAN chipset. The company currently also provides a state-of-the-art baseband processor to complete the physical layer of 802.11b.

Preliminary performance and yield results indicate that the RT2420 transceiver IC is now ready for high-volume manufacturing on TSMC’s 0.35-micron SiGe BiCMOS process. The RT2420 achieves excellent receiver sensitivity under all conditions, thanks to a combination of 3.5 dB system noise figure and –15 dBm input third-order intercept point (IIP3) for the front-end. It also delivers ample clean power to drive the power amplifier (PA) in transmit mode, a result of excellent adjacent channel power ratio (ACPR). The power consumption is 44 mA in receive mode and 42 mA in transmit mode, respectively.

“Our cooperation with TSMC synchronizes our pioneering radio transceiver development with their advanced technology development for outstanding performance and short development cycle,” said Sheng Lee, CTO of Ralink Technology. “SiGe BiCMOS technology is a welcome addition to TSMC’s impressive process lineup and is ideal for our radio architecture with its low-cost, small-form factor and low-power consumption.”

“Ralink’s design is another example of how TSMC’s industry-leading R&D and manufacturing teams can quickly bring new technology to market. It greatly expands the application space for high-speed wired and wireless communications applications,” noted John Wei, director of Platform Technology Marketing at TSMC.

Ralink’s radio architecture on TSMC’s SiGe BiCMOS process reduces design complexity, cost, and power consumption while enabling small-form factor designs. Compared to a CMOS solution, a RF design using SiGe technology can result in higher performance, lower power consumption, better ESD protection, and faster time to market. Thanks to TSMC’s excellent process design kit (PDK) and fabrication know-how, Ralink Technology has attained first-pass-yield success.

About Ralink Technology, Corp.

Ralink Technology, Corp. is a fabless wireless semiconductor company that develops physical-layer chipsets for all WLAN standards, including the popular 802.11b, new 802.11a, and the upcoming 802.11g that matches the 802.11a in speed and is backward compatible with the 802.11b. Ralink’s innovative radio frequency (RF) and baseband technologies offer optimum physical-layer solution for all WLAN standards. The company blends creative engineering talent with mature management, and is committed to the design of high-performance and power efficient wireless systems at low cost for the fast growing WLAN market. Ralink is a privately held company headquartered in Cupertino, California, with a design and support center in Hsinchu, Taiwan. For more information, please visit the Ralink website at www.ralinktech.com.