TSMC Wafer Process Equipment Recovered Steadily Sales for September and Q4 Estimated to Drop NT$2.8 Billion

Hsin-Chu, Taiwan, September 28, 1999- Taiwan Semiconductor Manufacturing Company Ltd. ("TSMC" or "the Company" ) (TAIEX: 2330, NYSE: TSM) today announced its latest recovering progress at 6:30 pm. At press time, 90 percent of the Company's wafer process equipment has already been released for production. Meanwhile, wafer shipment has continuously been increasing.

TSMC spokesman, YC Huang expressed his gratitude toward TSMC's suppliers, customers and the general public for their assistance and support. Mr. Huang also stated, "Most of our equipment has already been relased for manufacturing, and the wafer moves are expected to reach 80 percent by the end of this month."

Mr. Huang indicated that the Company estimated an amount of 28 thousand scraped wafers caused by the quake. The sales revenue is expected to reduce by NT$ 2.8 billion for September and the fourth quarter. However, with the insurance coverage, the earthquake's impact on the Company's profit is expected not to exceed NT$1 billion.