TSMC Announces Wafer Solder Bumping Volume ProductionAdvanced Technology Partner Altera Corp. Qualifies TSMC Bump Line for Volume Production

Hsinchu, Taiwan, April 19, 2001 --Taiwan Semiconductor Manufacturing Company (NYSE: TSM) today became the first dedicated foundry to deliver production silicon employing wafer bumping technology, and to provide an in-house wafer solder bumping service. The bump line facility was first opened in November 2000, and the company has since qualified the process for volume production with advanced technology partner Altera Corporation. The facility has a capacity of up to 15K wafers/ month.

“The demand for highly integrated, system-on-chip designs brings with it a need to improve not only the semiconductor process, but the package and the interface to other parts of the system,” said Justin Wang, deputy director of strategic services marketing at TSMC. “Increasingly, designers are anxious to migrate to flip-chip packaging to further reduce the overall device size, allow higher I/O counts, and enhance overall performance. This requires a new approach to I/O integration, and wafer solder bumping is that approach.”

“After extensive testing and development, we are confident that TSMC has created a reliable, sensible technical approach to wafer bumping that will enable a highly integrated flip-chip package alternative for our products,” said Vincent Wang, senior director of packaging at Altera Corporation. “TSMC and Altera have once again demonstrated that collaboration in advanced technical development can result in an industry leading solution with significant competitive advantages.”

TSMC is the first and only dedicated foundry to offer an in-house bumping service that is based on a total flip chip application. This full-service package features bumping, post-bumping wafer sort, I/O pad redistribution, spice model simulation service, and support for back-end assembly subcontracting management. This one-stop service enables greatly simplified logistics and the shortest cycle time in the industry. TSMC's wafer solder bumping services are also available on selective 0.13um CyberShuttle for customer prototyping.

TSMC’s wafer solder bumping service will be a major focus at TSMC’s Technology Symposiums, which will be held on April 23rd in San Jose, CA.; April 25th in Austin, TX.; April 27th in Boston, MA.; and April 30th in Costa Mesa, CA. To register for any Symposium, go to www.tsmc.com and click on the Technology Symposium registration button.

About Altera

Altera Corporation, The Programmable Solutions Company, was founded in 1983 and is a leading supplier of programmable logic devices (PLDs). Altera’s CMOS-based PLDs are user-programmable semiconductor chips that enhance flexibility and reduce time-to-market for companies in the communications, computer peripheral, and industrial markets. By using high performance devices, software development tools, and sophisticated intellectual property cores, system-on-a-programmable-chip (SOPC) solutions can be created with embedded processors, memory, and other complex logic together on a single PLD. Altera common stock is traded on The Nasdaq Stock Market under the symbol ALTR. More information on Altera is available on the Internet at http://www.altera.com.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry’s leading process technology, library and IP options and other leading-edge foundry services. TSMC operates two six-inch wafer fabs and six eight-inch wafer fabs. The Company also has substantial capacity commitments at two joint ventures fabs (Vanguard and SSMC) and WaferTech. In 2000, TSMC produced the foundry industry's first 300mm customer wafers and began constructing two dedicated 300mm fabs. TSMC's corporate headquarters are in Hsin-Chu, Taiwan. More information about TSMC is available through the World Wide Web at http://www.tsmc.com.