Hsin-Chu, Taiwan, October 6, 1998- Taiwan Semiconductor Manufacturing Company (TSMC) (NYSE: TSM) today announced a reorganization of its corporate marketing and sales and operations organizations. In conjunction with these changes, the company also announced the appointment of Mr. Magnus Ryde as President, TSMC-USA.
Mr. Ron Norris, formerly president of TSMC-USA, has been named senior vice president of Worldwide Marketing & Sales and will be based in TSMC's Hsin-Chui, Taiwan headquarters, where he will report directly to TSMC president F.C. Tseng. In his new position, Mr. Norris will hold overall responsibility for business operations in the United States, Europe and Japan and for Asia market and technical services. In addition, he will also direct the corporate marketing, corporate business planning, and customer engineering operations.
Mr. Magnus Ryde has been named President of TSMC-USA, succeeding Mr. Norris. Mr. Ryde was previously vice-president of worldwide field operations at KLA-Tencor, with total revenue responsibility for $1 billion.
As part of the re-organization, Mr. Steve Tso, formerly senior vice president of corporate sales and marketing, has been named senior vice president of manufacturing technology and services. In his new capacity, Mr. Tso will assume responsibility for Production Control and Turnkey Service, New Fab Planning and Engineering, and Technology Transfer Programs.
As the new president of TSMC-USA, Mr. Ryde brings a mix of marketing, sales and manufacturing experience acquired during his 18-year tenure at KLA-Tencor. Since joining the company in 1980, Mr. Ryde held a variety of positions, including manufacturing manager, product marketing manager, KLA Europe Director, VP of Operations and VP of Corporate Sales. He is a graduate of Linkoping University of Sweden and received his Industrial Engineering MS degree from Stanford University in 1980.
"This reorganization and the addition of Magnus Ryde to an already strong management team simultaneously leverages the individual talents of some of our key executives and provides us with the impetus required to continue to expand the global presence expected by our customers, partners and shareholders," said Dr. Chang, Chairman TSMC. Ltd.
TSMC (ADS traded NYSE: TSM, also traded on TSE) is the world's largest dedicated integrated circuit (IC) foundry and offers a comprehensive set of IC fabrication processes, including processes to manufacture CMOS logic, mixed-mode, volatile and non-volatile memory and BiCMOS chips. Currently, TSMC operates two six-inch wafer fabs (Fab 1 and 2) and three eight-inch wafer fabs (Fab 3, 4, and 5), all located in Hsin-Chu, Taiwan. In mid-1998, TSMC announced that production wafers were being delivered from its first U.S. foundry, WaferTech, a joint venture with Altera, Analog Devices and Integrated Silicon Solutions, Inc. The company has broken ground in the new Tainan Park, which will house Fabs 6 and 7 and recently announced its participation in a $1.2 billion joint venture fab with Philips Semiconductor which is scheduled to open in Singapore in 2000. TSMC's corporate headquarters are in Taiwan. More information about TSMC is available through the World Wide Web at http://www.tsmc.com.