TSMC Announces Foundry Industry's First 0.25-Micron Logic-Based Embedded DRAM for SOC DesignsSilicon Magic Uses Technology for Next-Generation Information Appliances

November 11, 1999, Hsin-chu, Taiwan - Taiwan Semiconductor Manufacturing Company (NYSE: TSM) today becomes the first foundry to make commercially available 0.25-micron logic-based embedded DRAM as an option on its 0.25-micron process technology. TSMC's embedded DRAM features the high performance and a small cell size ideal for efficiently integrating memory directly into system-on-chip (SOC) designs. Silicon Magic, a manufacturer of DRAM and embedded DRAM solutions for the next-generation information appliance market, is the first customer to use this technology.

"TSMC is at the forefront of the foundry industry in offering this capability," said Roger Fisher, senior director of corporate marketing at TSMC. "The small cell size of logic-based embedded DRAM architecture will allow TSMC to pack significantly more memory into a given chip. This is expected to be a key differentiator that appeals to designers implementing next-generation SOC designs."

"Advanced wafer processing techniques developed by TSMC enable strong system companies, such as Silicon Magic, to build state-of-the-art system-on-a-chip solutions," said Alex Au, president of Silicon Magic. "We chose TSMC for its strong manufacturing capability and reliable supply lines. Once the designs are in place, our customers can be confident of on-time delivery."

TSMC's embedded DRAM technology utilizes a traditional DRAM architecture, with the addition of two metal layers for easy integration with other on-chip system blocks. The technology may be delivered as an IP core in various configurations with densities from 1 to 64 megabits (Mb) with a stacked-capacitor cell size of just .78 m m2. The logic-based embedded DRAM is fully compatible with TSMC's existing 0.25-micron library technology and features electrical performance identical to the 0.25-micron logic process.

Availability

TSMC is accepting tapeouts for the products utilizing embedded DRAM in the 0.25-micron technology now. TSMC's embedded DRAM offering is a part of the company's turnkey technology offering, including process, design service, testing, and customer support.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology, library and IP options and other leading-edge foundry services. TSMC operates five eight-inch wafer fabs (Fab 3, 4, 5, TASMC and WaferTech), and two six-inch wafer fabs (Fabs 1 and 2). In addition, the company is ramping Fab 6, located in Tainan Taiwan, for production and has begun construction of a $1.2 billion joint venture fab with Philips Semiconductor, which is scheduled to open in Singapore in 2000. TSMC will break ground for a new 12-inch wafer fabrication facility in the first quarter of 2000 in Hsin-Chu and for fab 7 in Tainan, which will be the companies sixth eight-inch fab. In year 2000, TSMC will have the capacity for nearly 3 million 8-inch equivalent wafers. Fabrication processes offered by TSMC include CMOS logic, mixed-mode, volatile and non-volatile memory, and BiCMOS. TSMC's corporate headquarters are in Hsin-Chu, Taiwan.