TSMC Announces Foundry Industry's First 0.35μm BiCMOS ProcessTSMC's latest application-specific process technology targets communications and wireless applications

Hsinchu, Taiwan, March 1, 2001 --Taiwan Semiconductor Manufacturing Company (NYSE: TSM), the world’s leading semiconductor foundry, today announced that the foundry’s first 0.35μm BiCMOS process has been transferred to production.

The company has verified that both the MOS and bipolar technologies within the process have achieved TSMC’s aggressive specifications, including a maximum operating frequency (fmax) of 40 GHz. The first fully integrated silicon (for cellular applications) is now being shipped to an undisclosed customer for functional verification. Production will begin in April, followed by increasing volumes as the process is ramped in various TSMC fabs. Technology data, including SPICE models, design rules and electrical specifications are available to designers who want to target their designs to the process.

This 0.35μm BiCMOS process provides designers with an alternative platform for communications applications, in addition to the company’s comprehensive offering of mixed-signal / RF CMOS processes and technologies.

The BiCMOS process and its extensions in SiGe will be presented at TSMC’s Technology Symposiums, which will be held on April 23rd in San Jose, Calif.; April 25th in Austin, Tex.; April 27th in Boston, Mass.; and April 30th in Costa Mesa, Calif. To register for any Symposium, go to www.tsmc.com and click on the Technology Symposium registration button.

About TSMC 0.35?strong>m BiCMOS Process

TSMC’s 0.35μm BiCMOS features a core voltage of 3.3-volts. The optimized process features an NPN bipolar device with a cut-off frequency (fT) of 25 GHz, and a maximum frequency (fmax) of 40 GHz. TSMC also provides a high performance metal capacitor (MiM), high precision resistors, and high voltage NPN (>12 V) devices that enable more flexibility and higher integrity for RF designs.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry’s leading process technology, library and IP options and other leading-edge foundry services. TSMC operates two six-inch wafer fabs and six eight-inch wafer fabs. The Company also has substantial capacity commitments at two joint ventures fabs (Vanguard and SSMC) and WaferTech. In 2000, TSMC produced the foundry industry's first 300mm customer wafers and began constructing two dedicated 300mm fabs. TSMC's corporate headquarters are in Hsin-Chu, Taiwan. More information about TSMC is available through the World Wide Web at http://www.tsmc.com.