TSMC Delivers Second Round of 0.13-Micron Customer Products

HSINCHU, Taiwan, December 19, 2000 - Taiwan Semiconductor Manufacturing Company (NYSE: TSM), the world’s largest dedicated semiconductor foundry, followed its announcement last week of the industry’s first 0.13-micron product with the news that it has released three more 0.13-micron customer products. Among customers who have received 0.13-micron wafers, two companies have already completed their evaluations and verified functional silicon, and others are currently evaluating their chips.

Not only is TSMC the first to tape out and deliver customer products using the industry-leading 0.13-micron process, it’s also the first to tape out and deliver products using multiple 0.13-micron process variations. TSMC’s 0.13-micron core (CL013G), low power (CL013LP) and high performance (CL013LV) technologies are each designed to enable optimum performance for specific application areas. All were utilized in the previously announced tape-outs. Customers who have received their 0.13-micron wafers are TSMC advanced technology partners and acknowledged industry leaders in the microprocessor, personal computing and communications markets.

“There is no measure of leadership quite like having your customers say you are the leader,” said Dr. FC Tseng, president of TSMC. “Based on last week’s input from Via Technologies, Inc., and confirmation of functional silicon for a second customer, it’s clear that our 0.13-micron process technology is the proven industry leader. TSMC has invested a tremendous amount of resources in bringing this process to market, but that’s just the start of what we are prepared to do. With continued process variations, including mixed-mode and RF modules not far behind, TSMC is firmly establishing itself as the leading provider of advanced technology worldwide.”

“TSMC is delivering customer products using our 0.13-micron process, well ahead of schedule. For customers, this means gaining competitive advantages by bringing their new designs earlier to market. This is absolutely critical to their continued success,” added Mike Pawlik, vice president of corporate marketing for TSMC.

About TSMC’s 0.13-Micron Process

TSMC’s advanced 0.13-micron process delivers the foundry industry’s most advanced technology for high-performance, high-density system-on-chip (SOC) designs. The process features a complete technology family, including core, high-performance, ultra-high-speed and low-power offerings. It is ideal for high-performance, high-bandwidth applications, wireless Bluetooth RF applications, and ultra-high-performance CPU applications.

Built to TSMC’s industry-leading standards for quality and reliability, the 0.13-micron process provides a 72 percent shrink versus TSMC’s popular 0.18-micron technology, enabling more logic density per square millimeter for system-level integration with the highest possible performance. The process supports all TSMC technology offerings, including logic, embedded flash, and mixed signal technologies.

Primary features of the 0.13-micron process include a 1.0-volt core, 2.5 or 3.3-volt I/Os, a gate length of 0.08 micron, and a ring oscillator performance rating of 11 picoseconds delay for small ring oscillators at 1.2V and 14 picoseconds/gate at 1.0Vfor the CLO13LV (high-performance) process. The embedded 6T SRAM cell size is 2.43um2, representing a 52 percent shrink versus TSMC’s 0.18-micron process.

TSMC’s 0.13-micron process delivers industry-leading performance, density and reliability on the industry’s widest array of technology platforms for advanced system-on-chip design. These platforms include:

Core (CL013G): Easy migration, process integration platform for computing, communications, and high-density programmable logic High Performance (CL013LV): Low voltage,