TSMC Announces Foundry Industry’s First Automated FlashROM? ServiceNew Service Helps Convert On-chip Flash into MROM, Reducing Manufacturing Cost and Accelerating Time-to-volume

HSIN-CHU, Taiwan—April 10, 2001— Taiwan Semiconductor Manufacturing Company (NYSE: TSM), the world’s largest dedicated semiconductor foundry, today announced the foundry industry’s first automated FlashROM? service in support of its EmbFlash? process technology. The new FlashROM service is provided to EmbFlash customers who need help reducing manufacturing cost and accelerating time-to-volume by automatically converting on-chip flash into “mask-based” ROM (MROM).

TSMC’s EmbFlash technology is used by designers who need flexible system blocks for code or data reprogrammability. The EmbFlash technology is particularly advantageous for designs requiring in-system programming, product re-use, or last-minute code alterations.

Once the design is relatively stable in the field, some companies choose to look for lower-cost alternatives to large amounts of embedded flash in high-volume production. TSMC’s FlashROM provides that flexibility without requiring a complete redesign of the chip. This is significant, as all other foundry-based alternatives require removing the flash block and replacing it with an MROM block. Through TSMC’s new FlashROM service, designers can convert the flash-based portion of the product to MROM version directly, without modifying other portions of the logic design. All design, layout and manufacturing is accomplished in a very short cycle.

“TSMC’s FlashROM service saves redesign efforts and accelerates time-to-volume, compared to earlier conversion methods,” said Mike Pawlik, vice president of corporate marketing for TSMC. “Moreover, it reduces the number of masking and testing steps while improving overall wafer yield. TSMC will continue to develop these and other innovative EmbFlash technologies and services to meet the evolving requirements of today’s SoC designers.”

The FlashROM service will be a major focus at TSMC’s Technology Symposiums, which will be held on April 23rd in San Jose, Calif.; April 25th in Austin, Tex.; April 27th in Boston, Mass.; and April 30th in Costa Mesa, Calif. To register for any Symposium, go to www.tsmc.com and click on the Technology Symposium registration button.

About EmbFlash?

TSMC's EmbFlash is the foundry industry's leading embedded flash technology. This reliable and cost-effective technology allows designers to customize a broad range of products found in MCU, DSP, smart card, cellular communications, automotive, CPLD, and other applications.


TSMC’s FlashROM service is currently available for customers targeting TSMC’s 0.5μm process. The service will be ported to TSMC’s 0.35μm process by mid-2001 and to the 0.25μm process by the fourth quarter of 2001.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry’s leading process technology, library and IP options and other leading-edge foundry services. TSMC operates two six-inch wafer fabs and nine eight-inch wafer fabs in three countries, including its two joint ventures fabs – Vanguard and SSMC – and its North American subsidiary, WaferTech. In 2000, TSMC produced the foundry industry's first 300mm customer wafers and began constructing two dedicated 300mm fabs. TSMC's corporate headquarters are in Hsin-Chu, Taiwan. More information about TSMC is available through the World Wide Web at http://www.tsmc.com.