Hsinchu, Taiwan, March 9, 2001 -- Taiwan Semiconductor Manufacturing Company Ltd. (“ TSMC” or “ the Company” ) (TAIEX: 2330, NYSE: TSM), today announced that it will decommission its Fab 1 on March 31, 2002, following a year-long, phased decommissioning plan. According to the Company’s plan, most of the processes in the fab will move to other TSMC facilities before March 31, 2002 to ensure continuing high-quality customer service.
Ms. K. C. Chen, TSMC spokesperson, pointed out that the Company has planned the transfer of capacity and technology in advance. Customers have been notified and work transfers are already underway. “We have already begun working with our customers to make sure that the Fab closing has the smallest conceivable affect on the business and technology plans of all parties,” said Ms. Chen.
TSMC opened Fab 1 in 1987 on the Chung Hsing Compound at Taiwan’s Industrial Technology Research Institute. The Company had leased Fab 1 from Taiwan’s Ministry of Economic Affairs and Industrial Technology Research Institute. The agreement is scheduled to expire on March 31, 2002. The fab utilizes 6-inch wafers, primarily to produce logic products. The full operating capacity of the fab is approximately 20,000 6-inch wafers per month (equivalent to about 11,000 8-inch wafers per month).