MOUNTAIN VIEW, Calif., March 12, 2001 – Mysticom, Ltd. today announced that it is the first semiconductor intellectual property (SIP) supplier to successfully port and verify in silicon a high-performance 10/100 Mbps Ethernet physical layer (PHY) core using the advanced Taiwan Semiconductor Manufacturing Company (TSMC) 0.18-micron digital CMOS process.
This development enables Mysticom to offer hundreds of designers using TSMC’s foundry services access to a proven, high-speed PHY core that is ready for integration into complex communications system-on-chips (SoCs). The availability of the Mysticom?MystiPHY?110 core as a hard macro enables these designers to take advantage of the inherent time-to-market benefits associated with using proven third-party SIP. They will also benefit from the cost savings and performance advancements that result from increased integration.
“The silicon-verified MystiPHY110 core is a clear proof point of Mysticom’s technical capabilities,” said Peyman Kazemkhani, Director of IP Marketing for TSMC. “Mysticom has demonstrated the architectural robustness and portability of its complex mixed-signal communications technology in the industry’s leading digital CMOS process.”
“TSMC continues to deliver on an aggressive process technology roadmap that includes ensuring early verification and availability of critical IP cores,” said Dr. David Almagor, CEO of Mysticom. “By continually anticipating and responding to market needs, TSMC allows customers to streamline the development of their complex SoC devices and bring products to market ahead of the competition.”
About the MystiPHY110 Core
The MystiPHY110 is a fully integrated IEEE 802.3/802.3u-compatible10/100Mbps Ethernet PHY core that is capable of working in both 10Base-T and 100Base-TX/FX Ethernet. It has been designed using patent-pending DSP and mixed-signal techniques and has been fully implemented and verified in TSMC silicon. The core has successfully passed University of New Hampshire (UNH) Interoperability Lab testing for standards conformance and interoperability.
The MystiPHY110 offers high noise and cross-talk immunity, meeting the IEEE specification for near-end crosstalk (NEXT). It also operates over cable lengths of up to 160 meters and features low power dissipation and a small core size. In addition, the core can be used in multi-port designs to enable higher levels of system integration.
TSMC IP Alliance
TSMC’s IP Alliance encompasses the industry’s largest catalog of silicon-verified and production-proven foundry specific intellectual property. Vendor cores are validated in TSMC silicon under the CyberShuttle multiproject wafer program to ensure the best possible design experience, easiest design reuse, and the fastest integration into an overall system design. The IP Alliance’s best-of-class IP offerings feature high-performance, system-level cores including embedded processors, digital signal processors, communications and networking IP, special memories, bus interfaces, RF and mixed-signal modules, multimedia IP and programmable logic. All cores in the TSMC catalog are directly sold and supported by the individual IP vendor to better support each customer’s particular design and business model. Each TSMC process-proven IP core complies with TSMC design rules and models.
TSMC is the world's largest dedicated semiconductor foundry, providing the industry’s leading process technology, library and IP options and other leading-edge foundry services. TSMC operates two six-inch wafer fabs and six eight-inch wafer fabs. The Company also has substantial capacity commitments at two joint ventures fabs (Vanguard and SSMC) and WaferTech. In 2000, TSMC produced the foundry industry's first 300mm customer wafers and began constructing two