Philips, TSMC and EDB Investments Team to Develop New Chip Production Facility

Science-Based Industrial Park, Hsin-Chu, Taiwan, September 25, 1998 -- Taiwan Semiconductor Manufacturing Company (TSMC or the Company) (NYSE: TSM) today lodged an application of NT$6 billion unsecured straight bond with the Taiwan Securities and Futures Commission (R.O.C. SFC) for its future expansion.

The Company will register this bond with the R.O.C. Over-the-Counter Security Exchange (OTC) after the completion of this issuance. These bonds will be offered and sold only in Taiwan, and no action will be taken to register or permit sales outside Taiwan.

This bond issuance is TSMC's third capital raising activity since 1998. Prior to this, TSMC has issued a corporate bond worth of NT$ 4 billion and a five-year Notes Issuance Facility (NIF) in March 1998 and in May 1998 respectively.