Sachiaki Nagae Named Chairman of TSMC JapanFormer President of Texas Instruments Japan to head up TSMC operations in Japan

Science-Based Industrial Park, Hsinchu, Taiwan, June 7, 2000 - Taiwan Semiconductor Manufacturing Company (NYSE: TSM) today announced the appointment of Mr. Sachiaki Nagae as Chairman of TSMC Japan. Mr. Nagae has held the post of Senior Advisor to TSMC Japan since January 1998 and now moves into the position of Chairman of the company’s Japan operations.

Prior to working with TSMC, Mr. Nagae enjoyed a prestigious career at Texas Instruments Japan. During Mr. Nagae’s term as President of the company, TI was the first foreign affiliate to receive the coveted Deming Award. This award was a major milestone for Texas Instruments and helped garner worldwide recognition for the quality of the company’s semiconductor products.

Mr. Nagae, who holds a degree from Tokyo Denki University, is a very visible force in Japan’s semiconductor industry. He currently acts as an advisor to many Japanese companies and professional associations, where his business perspective, garnered from his long-term leadership in the global marketplace, is highly valued.

"Taiwan Semiconductor Manufacturing Company is honored to have Mr. Nagae as Chairman of our Japan operations,” said Dr. Morris Chang, Chairman of the Board. “Mr Nagae’s guidance has been an invaluable asset to TSMC in the past, and we are very pleased that he has agreed to accept the position of Chairman.”

"TSMC has brought a new business model to the Japanese semiconductor market, and it will be very exciting to play a key role in further driving its development in Japan," said Mr. Nagae. "I believe, and am confident, that TSMC’s contribution as a global technology and service leader will be proven as a great benefit to Japan.”

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry’s leading process technology, library and IP options and other leading-edge foundry services. With the mergers of WSMC and TASMC (effective June 30, 2000), TSMC is constructing or operating 11 fabs and has substantial capacity commitments at three additional facilities jointly operated by TSMC and its partners. In 2000, TSMC expects to have the capacity for nearly 3.4 million 8-inch equivalent wafers. Fabrication processes offered by TSMC include CMOS logic, mixed-mode, volatile and non-volatile memory, and BiCMOS. TSMC’s corporate headquarters are in Hsin-Chu, Taiwan.