TSMC ANNOUNCES FOUNDRY INDUSTRY’SFIRST 0.13-MICRON CYBERSHUTTLEFirst 0.13-micron shuttle to take off on Nov. 1, 2000

HSIN-CHU, Taiwan, October 31, 2000 - Taiwan Semiconductor Manufacturing Company (NYSE: TSM), the world’s largest dedicated semiconductor foundry, today announced overwhelming response from customers for its first 0.13-micron CyberShuttle, the industry’s most active device-prototyping program. TSMC is the first foundry to offer prototyping of integrated circuits in the 0.13-micron geometry, the most advanced technology offered to-date for high-density, high-performance chip designs. The scheduled shuttle was so quickly oversubscribed, that TSMC added a simultaneous shuttle in an effort to accommodate the enthusiastic crowd. Still disappointing late comers would have to register for the next 0.13-micron shuttle, scheduled for Jan. 5, 2001.

With this 0.13-micron CyberShuttle, TSMC will produce prototypes for the complete technology family of logic and mixed-mode devices that includes core, high-performance, and low-power variations. Companies taking advantage of this shuttle include leaders in the computers and the communications industries, as well as leading library and IP vendors. The prototyping products span a wide range of applications, including devices for networking systems, set-up-boxes and specialty memories.

CyberShuttle is very important to the early design infrastructure and it truly enables concurrent engineering. With CyberShuttle, designers are able to explore the benefits of TSMC’s leading-edge 0.13-micron technology at low risk.

“The mask costs grow exponentially with each process generation, so it is a very expensive proposition to run an entire lot of wafers just to test the designs. CyberShuttle is TSMC’s answer to that challenge,” said Mike Pawlik, vice president of corporate marketing for TSMC. “The program dramatically reduces non-recurring engineering charges for prototyping. Fabless companies can afford to be more creative and maximize the success rate at the same time.” Designers who need to get the most logic per square millimeter – no matter what size the company – can take advantage of this fast prototyping method, at shared-cost, to accomplish their goals. TSMC will expand its CyberShuttle service, with on-line booking expected in early 2001.