GILBERT, Ariz., May 9 /PRNewswire/ -- Cerprobe Corporation (Nasdaq: CRPB) a leader in test interconnect solutions, today announced it has signed a multi-year agreement with Taiwan Semiconductor Manufacturing Company "TSMC" (NYSE: TSM), for probe card production and development. Under the agreement, Cerprobe will license its advanced epoxy probe card technology to TSMC, provide training and on-site technical support, which will enable TSMC to produce probe cards for its exclusive use at all facilities. As TSMC's key supplier, Cerprobe will also provide probe cards directly to TSMC. Also as part of the agreement, TSMC will become a beta-site test partner for Cerprobe's new probing technology developments.
Yeoung-Pey Chyn, TSMC Director said, "Cerprobe has worked closely with TSMC and demonstrated its superior probe card expertise. We're pleased to partner with Cerprobe to incorporate this expertise into our worldwide facilities. This will enable us to provide our customers with advanced integrated production and test capabilities. We are also excited about the beta-site partnership that allows TSMC to work with Cerprobe in developing new probing technology. We expect this relationship to benefit both companies, as well as our customers and the semiconductor industry as a whole."
Michael K. Bonham, Senior Vice President of Cerprobe, commented, "Cerprobe is extremely pleased and honored to be forming an alliance with the world's largest and most technologically advanced wafer foundry. This formalizes a close business relationship we have shared with TSMC since Cerprobe opened our Taiwan facility in 1997. The agreement will assist TSMC in strengthening its worldwide on-site capabilities, guarantee additional support as needed, and provide Cerprobe with a distinguished beta-site partner for evaluating new probing technology."
Cerprobe is a recognized world leader in the design and manufacture of semiconductor test interconnect solutions. The Company offers products and integrated systems for wafer and IC package testing. Cerprobe markets and distributes its products and systems worldwide and operates domestic manufacturing facilities in Arizona, California, and Texas, and international manufacturing facilities in France, Scotland, Taiwan, and Singapore. Additional information about Cerprobe is available at www.cerprobe.com.
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology, library and IP options, and other leading-edge foundry services. In year 2000, TSMC will have the capacity for nearly 3.4 million 8-inch equivalent wafers. Fabrication processes offered by TSMC include CMOS logic, mixed-mode, volatile and non-volatile memory, and BiCMOS. TSMC's corporate headquarters are in Hsin-Chu, Taiwan. More information about TSMC is available at www.TSMC.com.
The statements in this release regarding the benefits from the multi-year agreement with TSMC for probe card production, Cerprobe's status as TSMC's key probe card supplier, TSMC becoming a beta-site test partner for Cerprobe, TSMC's ability to integrate production and test capabilities, TSMC's continued status as the world's largest and most technologically advanced wafer foundry, Cerprobe's development of new technologies, and any expected benefit to both companies as well as their customers and the semiconductor industry as a result of this agreement are forward looking statements that include risks and uncertainties, including but not limited to product demand and development, ability to maintain customer diversity and relationships, technological advancements, impact of competitive products and pricing, growth in targeted markets, manufacturing capacity, risks of foreign operations, ability to integrate and leverage acquisitions, and other information detailed from time t