Hsinchu, Taiwan, March 26, 2001 -- Taiwan Semiconductor Manufacturing Company (NYSE: TSM), the world’s largest dedicated semiconductor foundry, today announced that it has successfully ramped the foundry industry leading 0.15μm process to full production status. TSMC has delivered the highly-anticipated GeForce3 GPU, in addition to the key processors for the Xbox? video game console, to NVIDIA Corporation (Nasdaq: NVDA) using the high-performance version of TSMC’s 0.15μm process (CL015LV). Several other customer products, using diverse 0.15μm process variations, are also in volume production stage.
“We are delighted to be among the first to make use of TSMC’s advanced 0.15μm process technology,” said Jen-Hsun Huang, president and CEO for NVIDIA. “This new process has enabled us to create more sophisticated processors for advanced graphics and multimedia applications. TSMC has clearly demonstrated that it is ahead of the curve with its state-of-the-art process technology.”
TSMC’s 0.15μm process targets leading-edge computer, communications, and consumer applications for high speed and low power consumption. The process provides significant performance advantages over 0.18μm processes while, at the same time, significantly reducing die cost.
“Our 0.15μm process is the industry’s most advanced technology in volume production, ” said F.C. Tseng, president for TSMC. “This is another example of TSMC’s leadership in meeting customer demand for aggressive technology introductions together with rapid transition to volume production. We have experienced increasing demand for our 0.15μm technology.”
NVIDIA Corporation, a global leader in advanced graphics and multimedia processing technology, is among the first companies to implement 0.15μm designs for the superior performance. NVIDIA has used this new process for the recently announced GeForce3 GPU, the Xbox Graphics Processing Unit (XGPU) and Xbox Media Communications Processor (MCPX).
TSMC’s 0.15μm process is an important platform that meets the market demand for an optimal combination of speed, power and density while accommodating a robust transition from aluminum to copper interconnects. TSMC was the first foundry to deliver the 0.15μm process technology, which was qualified in March 2000. The technology has been transferred to TSMC fabs, with ample capacity to meet growing customer demand.
The 0.15μm process will be a major focus at TSMC’s Technology Symposiums, which will be held on April 23rd in San Jose, Calif.; April 25th in Austin, Tex.; April 27th in Boston, Mass.; and April 30th in Costa Mesa, Calif. To register for any Symposium, go to www.tsmc.com and click on the Technology Symposium registration button.
About TSMC’s 0.15μm Process
TSMC’s 0.15μm technology family includes core-logic, high performance, ultra-high-speed and low power processes. All of these processes are in full production now.
TSMC’s 0.15μm technology employs seven layers of metal and has a poly gate length as small as 0.11-micron. Features include 1.2V and 1.5V core options and I/Os from 1.8 to 3.3V. The technology’s 6T SRAM cell size is 3.42um2 , the smallest in the industry. This enables the use of up to 16M of SRAM on a single die, making the technology ideal for a variety of system-on-chip (SOC) applications in the networking, computing and consumer market segments.
TSMC has already received an extensive array of 0.15μm libraries, such as core cells, memory compilers and I/O cells, from the industry’s leading library vendors, including Artisan Components, Avant!, Nurlogic, and Virage Logic.
NVIDIA Corporation (Nasdaq - NVDA), based in Santa Clara, CA., is the global leader in advanced graphics and multim