Hsin-Chu, Taiwan, February 2, 1999- Taiwan Semiconductor Manufacturing Company Ltd. (TAIEX: 2330, NYSE: TSM), ("TSMC" or the "Company") today opened the foundry industry to IC companies and System Houses designing specialized high voltage logic and mixed mode devices, announcing process support for a broad array of high-voltage process technologies.
The new processes include support for 8V, 16V, 20V and 40V devices working on 0.5￡gm, 0.6￡gm, 0.8￡gm and 1.0￡gm design rules.
"While every one, including TSMC, are pushing the envelope of deep submicron geometries, there has emerged a tremendous demand for high voltage capabilities. In response to that demand, we have created an entire suite of high voltage processes that, frankly, are not available through any other foundry, Ron Norris, Senior Vice President, Sales and Marketing, TSMC"
"Providing these high-voltage processes is consistent with our mission to offer advanced process technology to semiconductor companies of all types, whether they are fabless or have their own fab facilities," he explained. Because of their relatively specialized nature, the manufacture of the high-voltage, high power IC has been relatively limited. By offering a range of cost effective high-voltage processes, TSMC opens the market to innovative fabless IC companies, as well as IDMs and Systems Houses.
TSMC's high-voltage processes allow designers to integrate high-voltage, high-power devices with generic low-voltage logic and mixed-mode devices for system-on-chip applications. The ability to embed high-voltage modules into baseline logic and mixed-mode processes maximizes design flexibility and cost effectiveness in producing systems with reduced chip counts. Such flexibility and cost-effectiveness are critical in designing display driver ICs, power supplies, power management, telecommunications, automotive electronics and industrial controls, in which high-voltage processes are typical.
TSMC (ADS traded NYSE: TSM, also traded on TSE) is the world's largest dedicated integrated circuit (IC) foundry and offers a comprehensive set of IC fabrication processes, including processes to manufacture CMOS logic, mixed-mode, volatile and non-volatile memory and BiCMOS chips. Currently, TSMC operates two six-inch wafer fabs (Fab 1 and 2) and three eight-inch wafer fabs (Fab 3, 4, and 5), all located in Hsin-Chu, Taiwan. In mid-1998, TSMC announced that production wafers were being delivered from its first U.S. foundry, WaferTech, a joint venture with Altera, Analog Devices and Integrated Silicon Solutions, Inc. The company has broken ground in the new Tainan Park, which will house Fabs 6 and 7 and recently announced its participation in a $1.2 billion joint venture fab with Philips Semiconductor which is scheduled to open in Singapore in 2000. TSMC's corporate headquarters are in Taiwan. More information about TSMC is available through the World Wide Web at www.tsmc.com.tw