CAMBRIDGE, UK and HSINCHU, Taiwan, R.O.C –February 10, 2011 – CSR plc. (LSE: CSR) and TSMC (TWSE: 2330, NYSE: TSM) today announced they are collaborating on the adoption of TSMC’s leading edge 90-nm embedded flash process technology, IP and RF CMOS processes for CSR’s next-generation wireless products.
The 90-nm embedded flash process technology and IP can deliver twice the speed of previous generation 0.18-micron process technology and IP. It is ideal for portable communications, smart card and high-speed micro-controller applications.
CSR has validated a broad range of proprietary connectivity IP blocks based on the new process technology and IP, and incorporated them into its recently launched next-generation CSR8600 consumer wireless audio platform that delivers significant speed, power consumption and form factor advantages.
“This technical collaboration with CSR reinforces TSMC’s commitment to be the foundation for Europe’s Logic IC innovation,” said Jason Chen, senior vice president of worldwide sales and marketing at TSMC. “Our 90-nm embedded flash process technology and IP support high-performance, low-power and high-density memory that, along with our RF CMOS process, enables CSR to deliver next-generation SoC products.”
“Our close collaboration with TSMC on this 90-nm embedded flash process technology enables CSR to maintain its leadership in developing flexible, highly integrated SoC platforms for consumer audio applications with superior system performance and minimal footprint,” said Chris Ladas, executive vice president of operations for CSR. “One of CSR’s strengths is its ability to make new technologies available to our customers through our close and ongoing collaborations with companies such as TSMC, and we look forward to continuing our excellent long-term relationship with them.”
For further information about the new CSR8600 consumer wireless audio platform, also announced today, see http://www.csr.com/news/pr/release/447/en.
CSR plc is a leading provider of multifunction audio, connectivity and location platforms. CSR’s technology portfolio includes Bluetooth, GPS, FM, Wi-Fi (IEEE802.11), and other technologies to enable silicon platforms that incorporate fully integrated radio, baseband and microcontroller elements. CSR’s Connectivity Centre is designed to enhance the user experience with mainstream mobile devices by intelligent integration of multiple wireless connectivity and location-awareness technologies. CSR’s Location Platforms are complemented by wireless connectivity and multimedia capabilities for high-volume mobile consumer devices and commercial applications. CSR’s technology has been adopted by market leaders into a wide range of mobile consumer devices such as mobile phones, automobile navigation and telematics systems, portable navigation devices (PNDs), wireless headsets, mobile computers, mobile internet devices, GPS recreational devices, digital cameras, mobile gaming, plus a wide range of personal and commercial tracking applications. More information can be found at www.csr.com
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company’s managed capacity in 2010 totaled 11.33 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs™, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.