TSMC and Cadence in Join on Deep Submicron Models

TAIPEI, Taiwan, August 26, 1996 -- Cadence Design Systems, Inc. and Taiwan Semiconductor Manufacturing Company (TSMC) today announced their support for the public domain BSIM3v3 device model. The two companies have worked together to integrate BSIM3v3 models for TSMC's advanced process technologies with Cadence's SpectreTM simulator.

This move represents significant progress in moving the electronics industry away from product design flows based on proprietary device models. By supporting BSIM3v3 models and making them available to their respective customers, Cadence and TSMC enable designers of complex digital, analog and mixed signal designs to take advantage of the accuracy, speed, wider support, lower cost and scalability of these device models. This is especially critical for designers of leading-edge products in the communications, multimedia and consumer electronics industries.

"The complexity of today's electronic product development process is compelling the industry to move to highly accurate device models. This announcement represents Cadence's commitment to working with market leaders like TSMC to drive the adoption of non-proprietary device models," said Jim Douglas, vice president of product marketing for Cadence Design Systems. "We are confident that this collaborative effort by the leaders in EDA and semiconductor manufacturing will benefit the industry as a whole through lower design costs and hope it will serve as a catalyst for faster adoption of non-proprietary models."

As part of the collaboration between Cadence and TSMC, the two companies have worked together to extract, verify and qualify BSIM3v3 models for use by their respective customers. Models for TSMC's 0.5 micron/5 volt process are available for delivery with Cadence's Advanced SpectreTM simulator in September. BSIM3v3 models for TSMC's 0.5 micron/3.3 volt process are available for delivery in October. Models for other process technologies scheduled for future joint development efforts include TSMC's 0.35 micron 5 and 3.3 volt processes and 0.25 micron process.

"We have worked very closely with Cadence to ensure the BSIM3v3 models are pre-qualified for our mutual customers," said John Chen, vice president of research and development for TSMC. "Access to open device models for the latest device technologies coupled with state-of-the-art simulation allows designers to fine-tune and verify design performance in software early in the product development cycle, rather than through costly, time-consuming hardware prototypes. This represents a competitive advantage for our customers."

BSIM3v3 device models were developed at the University of California, Berkeley in 1993. These models are gaining wide acceptance for deep submicron digital, analog and mixed signal designs across a variety of target markets and applications. Compared to today's proprietary device models, BSIM3v3 models are scalable across device geometries and physical in nature allowing statistical correlation for high-volume production.

Cadence Design Systems, Inc. provides comprehensive services and technology for the product development requirements of the world's leading electronics companies. Cadence is the largest supplier of software tools and professional services used to accelerate and manage the design of semiconductors, computer systems, networking and telecommunications equipment, consumer electronics, and a variety of other electronic-based products. With more than 3,000 employees and annual sales in excess of a half-billion dollars, Cadence has sales offices and research facilities around the world. The company is headquartered in San Jose, California and traded on the New York Stock Exchange under the symbol CDN.

TSMC is the world's largest and fastest growing dedicated semiconductor foundry manufacturing