HSIN-CHU, Taiwan, November 16, 2000 - Taiwan Semiconductor Manufacturing Company (NYSE: TSM), the world’s largest dedicated semiconductor foundry, said today it has begun delivering process data to selected EDA analog synthesis tool providers. The new initiative shares critical mixed-signal data with Antrim, Barcelona, and Neolinear for TSMC’s industry-leading mixed-signal processes, including the industry’s only 0.18-micron mixed-signal process.
These TSMC processes are the foundation for a variety of end-use products, including cell phones, BlueTooth devices, and many other wireless applications. By supporting leading analog synthesis EDA tools, TSMC is helping designers to bring these applications to market faster.
Neolinear, Barcelona, and Antrim tools automate various steps in analog component design, including automatic analysis and layout generation, which together minimize silicon iterations. In addition, this automation results in easy retargeting of analog components to a new semiconductor process. “The tremendous demand for wireless systems, networking, multimedia and other popular devices – most of which contain analog circuitry -- has created a great need for effective analog and mixed-signal design tools,” said Dr. Andrew Moore, design services marketing manager for TSMC. “By providing our process data to these EDA companies, TSMC hopes to ease the path for designers of PLLs, filters, and other critical mixed-signal and RF blocks.”
“Rapid synthesis and retargeting of analog blocks is critical to time-to-volume in the communications IC arena. TSMC shows vision in enabling designers to deploy these tools in their foundry analog product flow; this is the right move at the right time,” said Rita Glover, principal analyst of EDA Today.
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology, library and IP options and other leading-edge foundry services. TSMC operates two six-inch wafer fabs (Fab1 and 2) and six eight-inch wafer fabs (Fab 3, 4, 5, 6, 7, and 8). The Company has substantial capacity commitments at three joint ventures fabs - Vanguard, WaferTech, and SSMC. TSMC is currently ramping the industry's first 300mm pilot line at its Fab 6 and is constructing two dedicated 300mm fabs, Fab 12 in Hsin-Chu and Fab 14 in Tainan. In 2001, TSMC expects to support a capacity of nearly 4.8 million eight-inch equivalent wafers. Fabrication processes offered by TSMC include CMOS logic, mixed-mode/RF, volatile and non-volatile memory, and BiCMOS. TSMC's corporate headquarters are in Hsin-Chu, Taiwan. More information about TSMC is available through the World Wide Web at http://www.tsmc.com