Business Week Chooses TSMC's Senior Vice President Shang-Yi Chiang as “Star of Asia“

Science-Based Industrial Park, Hsin-Chu, Taiwan, June 26, 2001 - Taiwan Semiconductor Manufacturing Company Ltd. (TSMC or the “Company”) (NYSE: TSM) today announced that Dr. Shang-Yi Chiang, senior vice president for research and development at TSMC, was chosen as one of the 50 "Stars of Asia" by BUSINESS WEEK Magazine. Dr. Chiang is the sole winner from Taiwan under the "Innovator" category. The award recognizes the outstanding performance of TSMC's R&D team under Dr. Chiang's leadership, and his vision and strategies for continued aggressive R&D development despite the industrywide downturn.

The starts of Asia were selected by reporters and editors at BUSINESS WEEK Magazine to recognize outstanding entrepreneurs, innovators, managers, financiers, policy makers, and opinion shapers. This year the reporters and editors had to sort through a longer list of potential candidates than ever before. The Stars of Asia award ceremony will be held in Kuala Lumpur, Malaysia on June 27th, 2001.

"Under Dr. Chiang's leadership, TSMC's R&D team has outperformed itself again and again in the past few years. Especially in last year, TSMC led the global foundry industry by launching 0.13um technology, which was one year ahead of the ITRS (International Technology Roadmap for Semiconductor) roadmap. In the same year, TSMC set an industry landmark by becoming the first foundry to license its advanced logic processes to an integrated device manufacturer (IDM) company. In addition, TSMC also led the foundry industry by delivering the first 300mm customer wafers in year 2000," said Dr. FC Tseng, TSMC President.

TSMC’s R&D team continues to set new landmarks in the R&D arena. Recently, for example, TSMC was the first foundry to successfully deliver customer chips on 300mm wafers using 0.13um technology. In addition, TSMC has completed the basic modules for the foundry industry’s first 0.10um CMOS logic process technology. The company has also started an initiative to align a large number of first-tier technology companies globally to this industry-leading process technology, which is expected to increases the competitiveness of both TSMC and its customers.

Although the overheated situation in the global semiconductor market returned to a more normal pattern starting Novemeber 2000, TSMC continues to develop next-generation processes to provide customers with the best and the most advanced foundry services possible. In 2000, TSMC spent over NT$5 billion on R&D, and is expected to double that figure for 2001 to NT$ 10 billion.

Profile of Dr. Shang-Yi Chiang

Dr. Chiang joined TSMC since 1997. Since then, he has led TSMC’s R&D team through the successful launches of its 0.18um, 0.15um, and 0.13um technologies, and completed the basic modules for the foundry industry’s first 0.10um CMOS logic process. Under Dr. Chiang’s leadership, TSMC’s R&D team has recorded several landmark achievements, including the development of a copper interconnect process, 300mm production lines, and advanced system-on-chip (SOC) process technologies. Dr. Chiang has worked in the semiconductor industry for more than 20 years, and has published 43 papers and owns 8 US patents.

After graduating from the Electrical Engineering Department at National Taiwan University in 1968, Dr. Chiang received a master's degree in Electrical Engineering from Princeton University in 1970 and a Ph.D. from Stanford University in 1974. In 1975 he joined ITT for a year and then moved to Texas Instruments (TI) for five years. In 1980, Dr. Chiang joined Hewlett-Packard, beginning as a project leader in the development of submicron CMOS. He went on to take over management of the advanced materials research team, the Bipolar technology department and later headed the Device Research and Applications department, where he was responsible for 0.18um