SUNNYVALE, Calif. — March 11, 2002— Industry leaders Simplex Solutions, Inc. (Nasdaq: SPLX), Infineon Technologies (FSE/NYSE: IFX), and Taiwan Semiconductor Manufacturing Company (TSMC; NYSE: TSM) today announced the details of their collaboration that delivered Infineon’s recently unveiled Titan 19244, the world’s first single-chip 40Gbps framer-mapper device. Simplex’s SoC Design Foundry team helped to engineer the physical implementation for Infineon’s groundbreaking design, which was fabricated by TSMC. Through the three companies’ cooperative efforts, the complex, high-performance optical-networking chip performed to specification on first silicon.
The design for the Titan 19244 was originally developed by Catamaran Communications, which Infineon acquired on April 30, 2001. Catamaran was referred to the Simplex SoC Design Foundry through TSMC’s Design Center Alliance (DCA) program, a resource for customers requiring leading-edge design services.
“Upon meeting with Simplex’s SoC Design Foundry team, it was obvious that they were the most qualified team to create the physical implementation of our design,” said Vijay Mehra, vice president, VLSI engineering at Infineon-Catamaran. “The first-silicon results speak for themselves. The TSMC DCA provided much-needed support for matching us with the strategic partner we needed for this immense task.”
Details of Collaboration
Simplex’s SoC Design Foundry design team employed a hierarchical physical-design methodology to deliver first-silicon success for the Titan 19244, the first system-on-chip (SoC) with a data-transfer rate of 10Gbps X 4 / 40Gbps. The chip has more than 50 clock domains, with operating frequencies ranging from approximately 77Mhz to 700Mhz.
The SoC Design Foundry team achieved timing closure working closely with Infineon’s engineering team and leveraging Simplex-internal technologies for delay calculation—resulting in close correlation to SPICE. Voltage (IR) drop analysis, performed with Simplex’s VoltageStorm? SoC power-grid verification tool, showed voltage drop well within the specification.
TSMC manufactured the chip using its 0.15-micron low-voltage CMOS process technology with eight layers of metal, including a redistribution layer for bumps-to-I/O pad distribution. A custom substrate design specified by Infineon for a 1417-pin flip-chip ball-grid array (BGA) package was used to achieve the chip’s target performance and handle the dense high-speed I/O interfaces.
“The mission of TSMC’s Design Center Alliance, which now includes 28 partner companies worldwide, is to provide our customers with the quality design support they need to succeed.” said Genda Hu, Vice President Marketing at TSMC. “Simplex implemented Infineon’s design in TSMC 0.15-micron silicon with first pass success, clearly demonstrating the value of TSMC’s Design Center Alliance to our customers. ”
“Our mission is to provide our customers with the critical market advantage of first-silicon success for their most complex designs,” said Aurangzeb Khan, Simplex executive vice president and general manager of the company’s SoC Design Foundry. “Working with a ‘world’s-first’ design like the Infineon Titan 19244 presents us with exactly the kind of complex technical challenge that our design methodology was built to address and that our engineers thrive upon. We are very pleased to be able to contribute to the success of this pioneering chip design.”
Infineon Technologies AG, Munich, Germany, offers semiconductor and customized solutions for applications in the wired and wireless communications markets, for security systems and smart cards, for the automotive and industrial sectors, as well as memory products. With a global presence, I