Hsinchu, Taiwan, R.O.C. – November 9, 2010 - TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:
1. Approved capital appropriations of US$1,880.9 million to set up mini-lines for the wafer fab in Taichung, and to expand advanced technology capacity, twelve-inch capacity for wafer-level chip-scale packaging, and specialty technology capacity.
2. Approved 2011 R&D and sustaining capital appropriation of US$803.76 million.
3. Approved capital injection of 9.4 million euros into TSMC Solar Europe B.V.