Albany, NY and HSINCHU, Taiwan – (May 11, 2011) – SEMATECH, the international consortium of semiconductor manufacturers, and TSMC (TWSE: 2330, NYSE: TSM), a leading global semiconductor foundry, today announced TSMC’s decision to join SEMATECH as a core member. The cooperation will focus on advanced technology development to address some of the industry’s most pressing challenges.
TSMC will join SEMATECH to collaborate on semiconductor research and development for IC process technologies for 20nm generation and beyond, including extreme ultra-violet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and to develop critical infrastructure vital for next-generation manufacturing, including the transition to 450 mm wafer size.
SEMATECH's strong relationships with suppliers, chip makers, universities, and research institutes around the world are a critical element in providing cutting-edge research and development to its members. SEMATECH’s other core members include GlobalFoundries, HP, IBM, Intel, Samsung, UMC, and the College of Nanoscale Science and Engineering (CNSE).
“This relationship further reflects our commitment to push the boundaries of innovation and deliver leading-edge technology to our customers,” said Jack Sun, Vice President and CTO, Research and Development of TSMC. “This complementary cooperation leverages SEMATECH’s collaborative approach to lead critical industry technology transitions, with TSMC’s position as an industry leader in advanced technology development and manufacturing.”
“We're excited that this agreement expands our long-standing relationship with TSMC and we look forward to their contributions and technical insights from their perspective as a global leader in advanced semiconductor technology and manufacturing,” said Dan Armbrust, president and CEO of SEMATECH. “TSMC will be an important partner in accelerating the progress of R&D innovations and manufacturing solutions in leading edge technologies.”
SEMATECH manages an international network of world-leading collaborative partners, including foundries, IDMs, fabless, packaging and assembly companies, and material and equipment suppliers, to provide industry-wide solutions to the challenges of chip manufacturing.
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company’s managed capacity in 2010 totaled 11.33 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs™, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.
For over 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.