San Jose, CA, January 24, 1998- Taiwan Semiconductor Manufacturing Company (TSMC) (NYSE: TSM) today announced an agreement to port the Direct Rambus Access Cell (Direct RAC) to its 0.25-um logic process. The Direct RAC offers superior performance and a high-bandwidth standard interface for high-volume, low-cost memory controllers to the Rambus 800MHz memory. End product applications include main memory chip sets, graphics controllers, multimedia controllers, peripheral controllers and network switch controllers, to name a few.
"Rambus memory technology is becoming a valued element in high-performance systems," said Magnus Ryde, President, TSMC, USA. "As a result of this agreement, TSMC's customers will be able to smoothly integrate Rambus into their designs."
TSMC and Rambus plan to port the Direct RAC to the TSMC 0.25 micron logic process by April this year for silicon verification and characterization. Rambus will supply their common customers with the Cell for incorporation into customer product designs for manufacture at TSMC.
Direct Rambus memory
The Direct RAC offers unprecedented performance!X1.6 Gbytes/sec!Xeven from a single direct RDRAM device. With its 800 Mbits per pin interface, the Direct RAC is the highest bandwidth industry standard interface available. A 64 MB Rambus RIMM module is three times the performance of today's highest performing PC100 SDRAM DIMM module.
"By teaming up with TSMC, we are able to broaden the market for RDRAMs," said David Mooring, vice president and general manager for Rambus's PC division. "Rambus's high-bandwidth DRAC memory, combined with TSMC's, high-quality, volume production capabilities, will facilitate wide-spread adoption and allow a variety of applications to perform at higher speeds."
Over 50 companies support Direct Rambus system components, including RDRAMs, modules, connectors, clock chips and production test systems. Rambus memory is expected to become the industry standard by the end of 1999.
Rambus Inc. develops high-speed interface technology that allows DRAMs and controllers or processors to transfer data at 600 megabytes per second and above over the Rambus Channel, a narrow byte-wide data bus. The next-generation Direct Rambus? technology more than doubles this performance to provide up to 1.6 Gigabytes per second over a two-byte wide data bus. Rambus DRAMs are designed for low-cost, high volume manufacturing and use standard CMOS processing, plastic packages and conventional printed circuit board technology. Rambus is headquartered at 2465 Latham Street, Mountain view, Calif., 94040; phone: (650) 944-8000; fax: (650) 944-8080; e-mail: email@example.com. More information can be found at http://www.rambus.com.
TSMC is the world's largest dedicated integrated circuit (IC) foundry and offers a comprehensive set of IC fabrication processes, including processes to manufacture CMOS logic, mixed-mode, volatile and non-volatile memory and BiCMOS chips.
Currently, TSMC operates two six-inch wafer fabs (Fab 1 and 2) and three eight-inch wafer fabs (Fab 3, 4 and 5), all located in Hsin-Chu, Taiwan. In mid-1998, TSMC announced that production wafers were being delivered from its first U.S. foundry, WaferTech, a joint venture with Altera, Analog Devices and Integrated Silicon Solutions, Inc.
The company has broken ground in the new Tainan Park, which will house Fabs 6 and 7 and recently announced its participation in a $1.2 billion joint venture fab with Philips Semiconductor which is scheduled to open in Singapore in 2000. TSMC's corporate headquarters are in Taiwan. More information about TSMC is available through the World Wide Web at http://www.tsmc.com.tw.