Hsinchu, Taiwan, R.O.C. 5 November 2008 - TSMC (TSE: 2330, NYSE: TSM) has enhanced its 0.13um process technology with immediate availability of a 1.5/6/32V technology, targeted at high resolution mobile handset display drivers.
The high-yield process features an Aluminum Copper (AlCu) backend metal scheme and is designed to meet energy reduction targets, while responding to the market’s demand for smaller line width options, reducing die size in next-generation high-resolution display driver ICs.
The growing popularity of mobile TV and internet browsing demands a new generation of portable displays that feature high resolution and excellent power performance. The new 1.5/6/32V technology cuts die size requirements for new high-resolution mobile handset display drivers, while providing the high drive voltages required at the smaller 0.13um geometry.
TSMC’s new process is particularly compact and provides the smallest SRAM bit cell of any commercial foundry, at no compromise to speed and stand-by power. It also adds the necessary core voltage under-drive range, at 1.2V, to meet the most stringent green panel requirements. Furthermore innovative new fuse implementations simplify display optimization and matching during production testing.
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry’s largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company’s total managed capacity in 2008 is to exceed nine million (8-inch equivalent) wafers, including capacity from two advanced 12-inch Gigafabs, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.