Milpitas, CA. January 19, 2001 - Signia Technologies announced the successful demonstration of a 2.4GHz Bluetooth(TM) radio link that incorporates Signia? highly integrated transceiver IC fabricated on Taiwan Semiconductor Manufacturing Company? (TSMC?) industry leading 0.25um RF CMOS process. The transceiver was demonstrated in December 2000 as a component of Signia? Ulysses(TM) family of Bluetooth(TM) silicon and reference design solutions.
Signia? Ulysses(TM) SBT5010 transceiver contains the complete transmit and receive functions including a fully integrated synthesizer. The architecture implemented by Signia eliminates the need for external filters and inductors leading to a smaller footprint and a lower component count.
The Ulysses(TM) SBT5010 is the first Bluetooth(TM) transceiver demonstrated in TSMC's commercially available, volume 0.25um RF CMOS process, using TSMC's CyberShuttle for fast-track validation. TSMC's RFCMOS processes combine the advantages of a high-volume CMOS process with RF devices such as high-Q thick metal spiral inductors, MIM capacitors, triple-well isolated NMOS transistors, varactor diodes, and high sheet resistance polysilicon resistors. These technologies provide, for Bluetooth(TM) application, the best price-performance ratio, compared to technologies such as SOI, SiGe, and BiCMOS.
Marshall Wang, Signia's CTO and VP of engineering commented, "We are excited to be working with a world leader such as TSMC for their technology and manufacturing leadership. The maturity of TSMC's 0.25um RF CMOS technology allows Signia to provide solutions optimized for yield, cost and high volume production. This demonstration marks a significant milestone for Signia, broadening our portfolio of complete Bluetooth(TM) solutions."
"TSMC is the leading dedicated foundry to offer all-CMOS mixed signal and RF 0.25um, and 0.18um processes, "said John Chern, director of logic technology product marketing for TSMC. With the 0.25 um RFCMOS process, Signia has clearly demonstrated an innovative Bluetooth(TM) transceiver capability.
Signia's SBT5010 transceiver is the latest addition to its Ulysses(TM) Bluetooth(TM) product offering that includes Bluetooth baseband controllers, PCMCIA, compact flash and USB dongle reference designs.
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology, library and IP options and other leading edge foundry services. TSMC operates two six-inch wafer fabs and six eight-inch wafer fabs. The company also has substantial capacity commitments at two joint venture fabs (Vanguard and SSMC) and WaferTech. In 2000, TSMC produced the foundry industry's first 300mm customer wafers and began constructing two dedicated 300mm fabs. TSMC's corporate headquarters are in Hsin-Chu, Taiwan. More information about TSMC is available through the World Wide Web at http://www.tsmc.com.
About Signia Technologies:
Signia Technologies is a premier wireless solution provider with strong expertise in wireless integrated circuit, software, system, and networking design. Signia has demonstrated Bluetooth(TM) functionality in extended ranges of up to one hundred meters in notebooks, Internet access points, and PC cards. The company works in partnership with other Bluetooth(TM) members, customers, and value-added companies to provide the highest performance in Bluetooth(TM) using the most cost-effective technologies. Signia is an Associate Member of the Bluetooth(TM) Special Interest Group.
In early 1998 a group of computer and telecommunications industry leaders, including Intel, IBM, Toshiba, Ericsson, and Nokia, together began developing a way for users to connect a wide range of mobile devices quickly and easily, without cables. To ensure th