Hsinchu, Taiwan, R.O.C – October 20, 2010 – TSMC (TWSE: 2330, NYSE: TSM) today announced the creation of an annual TSMC Europractice Innovation Award for the most innovative mixed signal or RF (Radio Frequency) design submitted by a European university through the Europractice IC service coordinated by imec.
The award recognizes outstanding mixed signal or RF semiconductor design research in Europe and encourages smart silicon adoption.
The Europractice IC service offers more than 600 European universities and research institutes cost-effective and easy access to technologies and prototyping on TSMC’s CyberShuttleTM service.
Judging for the TSMC Europractice Innovation Award covers two rounds: a research paper and an oral presentation. In their papers, participants will give a clear explanation of the purpose and relevance of their research and its contribution to the field.
In the presentation round, participants who have passed the first stage will orally present their research to the award committee and participate in a discussion with the committee who may provide suggestions for further research. A panel made up of technical experts from imec, TSMC and Global Semiconductor Alliance (GSA) Europe will judge each paper based on its ingenuity, design efficiency, power efficiency and manufacturability based on real silicon results.
The prize will be a trip for two design team members to TSMC’s Headquarter in Taiwan, where winners will take a tour of one of TSMC’s GigaFabsTM. The award will be announced at GSA’s European Forum in May 2011.
“We believe that Europe is leading the world in mixed signal and RF silicon design innovation arising from its strong academic and research base. The Europractice Multi- Project Wafer service has long been a channel to unleash that innovation. We expect that the recognition this award provides will encourage European students to demonstrate their flair and innovation,” said Maria Marced, President, TSMC Europe.
For more information on award application, please email firstname.lastname@example.org.
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The company’s managed capacity in 2009 totaled 9.96 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GigaFabs™, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.
About Europractice IC service
Europractice IC service is an EC-funded project in the frame of FP7, coordinated by imec. The Europractice IC service offers affordable IC design EDA tools and IC prototyping services to 650 European universities and research institutes. Further information on Europractice can be found at http://www.europractice.com
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China and Japan. Its staff of more than 1,750 people includes over 550 industrial residents and guest researchers. In 2009, imec's revenue (P&L) was 275 million euro. Further information on imec can be found at www.imec.be.