Science-Based Industrial Park, Hsinchu, Taiwan, June 7, 2000 - Taiwan Semiconductor Manufacturing Company (NYSE: TSM) today announced the appointment of Mr. Tsuyoshi Kawanishi as Senior Advisor to TSMC Ltd.
Before joining TSMC, Mr. Kawanishi served as Senior Executive Vice President of Toshiba Corporation. A highly respected member of the Toshiba staff since 1952, Kawanishi played a significant role in developing and guiding the company’s overwhelmingly successful Japanese semiconductor business.
Kawanishi currently is the Chairman of the Society of Semiconductor Industry Seniors in Japan. He also serves on the boards of numerous global high-tech business leaders, including Applied Materials USA and Asyst Technologies, Inc, USA, and fulfills the post of Chairman of the Board for WSMC, Taiwan. In addition, Mr. Kawanishi acts as an advisor to many companies worldwide, helping to promote the mutual understanding of diverse cultural and business practices, and working toward the mutually beneficial resolution of the many challenges inherent in the world economy.
Mr., Kawanishi holds a degree from the Tokyo Institute of Technology, with a major in Electrical Engineering
"Taiwan Semiconductor Manufacturing Company is honored to have Mr. Kawsanishi become a part of our executive team,” said Dr. Morris Chang, Chairman of the Board. “Mr Kawanishi is an esteemed visionary in the semiconductor marketplace and is expected to contribute significantly to the expansion of TSMC’s service offerings to the Japan IC design community.”
"I am honored to have the opportunity to work with TSMC, an acknowledged IC manufacturing leader," said Mr. Kawanishi. "As the world's largest foundry with the most advanced technology and services, TSMC has much to offer the Japanese semiconductor industry."
TSMC is the world's largest dedicated semiconductor foundry, providing the industry’s leading process technology, library and IP options and other leading-edge foundry services. With the mergers of WSMC and TASMC (effective June 30, 2000), TSMC is constructing or operating 11 fabs and has substantial capacity commitments at three additional facilities jointly operated by TSMC and its partners. In 2000, TSMC expects to have the capacity for nearly 3.4 million 8-inch equivalent wafers. Fabrication processes offered by TSMC include CMOS logic, mixed-mode, volatile and non-volatile memory, and BiCMOS. TSMC’s corporate headquarters are in Hsin-Chu, Taiwan.