HSIN-CHU, Taiwan, July 12, 1999- Taiwan Semiconductor Manufacturing Company (NYSE: TSM), the industry's leading dedicated foundry, today announced the appointment of Hans Rohrer as President, TSMC Europe. Rohrer will be responsible for all of TSMC's European activities, reporting to Ron Norris, senior vice president, worldwide marketing and sales, TSMC, Ltd.
Prior to joining TSMC, Rohrer was vice president and general manager of National Semiconductor Europe for seven years. Under his leadership, National Semiconductor Europe's revenue grew to well above a quarter of National's worldwide revenues and was ranked among the top three suppliers by all of its major customers.
"Bringing more than 20 years of semiconductor experience in the European market to TSMC, Hans is a tremendous addition who reflects the company's commitment to expanding in this important market place," said F.C. Tseng, president of TSMC. "With his breadth of knowledge, TSMC Europe will be able to better understand and service its customers."
During his seventeen-year tenure at National Semiconductor Europe, Rohrer held several management positions including vice president and managing director Europe, vice president and director for VLSI products and group manager and managing director. Prior to his work at National Semiconductor, Rohrer held marketing and engineering positions at Texas Instruments and Diehl Data Systems.
Rohrer holds a master's degree in electronics and received business management education from Stanford University, Palo Alto, Calif.; and INSEAD, Paris, France.
"TSMC's technology and market leadership is a great foundation for the young European fabless industry as well as for OEM customers", said Rohrer. "I am excited to use my knowledge to help our European customers fully exploit their potential while stepping up TSMC's European presence and market position."
TSMC is the world's largest dedicated IC foundry and offers a comprehensive set of IC fabrication processes, including processes to manufacture CMOS logic, mixed-mode, volatile and non-volatile memory, and BiCMOS chips. Currently, TSMC operates two six-inch wafer fabs (Fab 1 and 2) and three eight-inch wafer fabs (Fab 3, 4 and 5), all located in Hsin-Chu, Taiwan.
In addition, TSMC is delivering wafers from its first U.S. foundry, WaferTech, a joint venture with Altera, Analog Devices and Integrated Silicon Solutions, Inc. The company is currently executing plans to house Fabs 6 and 7 in the new Tainan Park, and expects first wafer outs in the first quarter of 2000. TSMC recently announced its participation in a $1.2 billion joint venture fab with Philips Semiconductor scheduled to open in Singapore in 2000 and the formation of the TSMC-Acer foundry fab. TSMC's corporate headquarters are in Taiwan. More information about TSMC is available through the World Wide Web at http://www.tsmc.com.tw.